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BTS5215LXT

Infineon Technologies

BTS5215LXT by Infineon Technologies

BTS5215LXT by Infineon Technologies is a peripheral driver with 2 functions, operating at supply voltages b/w 5.5V to 40V. It offers built-in protections against transient, over current, over voltage, thermal, and under voltage conditions. This small outline device with gull wing terminals is ideal for applications requiring a nominal output peak current limit of 7.4A and fast turn-on/off times of 250us/270us.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 3,830 parts In-Stock

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3,830

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Vyrian

USA . 735 parts In-Stock

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735

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Digiode

USA . 137 parts In-Stock

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137

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Nova Conductors

Japan . 97 parts In-Stock

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97

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Modulus Dynamics

Lithuania . 4,032 parts In-Stock

1+ parts

$4.454

100+ parts

$4.276

1k+ parts

$4.098

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4,032

$4.454

$4.276

$4.098

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Aztec Data Supply Inc.

USA . 371 parts In-Stock

1+ parts

$7.790

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371

$7.790

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AZTECH Wire

Italy . 427 parts In-Stock

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$8.160

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427

$8.160

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.676

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$9.192

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$9.192

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100

$9.676

$9.192

$9.192

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Corohmni

South Africa . 90 parts In-Stock

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$13.905

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90

$13.905

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Ampacity Inc.

Singapore . 597 parts In-Stock

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$35.500

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597

$35.500

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Semicontronic

India . 868 parts In-Stock

1+ parts

$41.500

100+ parts

$40.462

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$40.255

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868

$41.500

$40.462

$40.255

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Argo Parts USA

USA . 4,764 parts In-Stock

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Continental Prestige Electronics

USA . 3,129 parts In-Stock

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Assy Fe

Spain . 400 parts In-Stock

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400

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Bastille Electronics

Australia . 10 parts In-Stock

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Corphita

USA . 4 parts In-Stock

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Overview

Unlock the power of your electronic devices with the BTS5215LXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and reliability. The BTS5215LXT falls under the category of Peripheral Drivers, offering built-in protections against transient events, over current, over voltage, thermal issues, and more. With its small outline and dual terminal position, this product is versatile and easy to integrate into your projects. Experience seamless performance and enhanced functionality with the BTS5215LXT - the perfect choice for all your driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and sturdiness to the product, making it long-lasting and reliable.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 40 V

Ability to handle high supply voltages ensures compatibility with a wide range of applications.

No. of Functions: 2

Provides versatility and flexibility in performing multiple functions, making it a cost-effective solution.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on circuit boards, ideal for applications with limited area.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive protection features ensure the safety and longevity of the connected devices.

No. of Terminals: 12

Sufficient terminals for connectivity options, enabling customization and adaptation to various system configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Innovative packaging design enhances thermal management and overall performance of the product.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage requirement enables operation in power-constrained environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in wiring configurations, accommodating different installation orientations.

Maximum Seated Height: 2.6 mm

Low profile design allows for space-efficient assembly in compact devices or applications.

Width: 6.4 mm

Slim width enables the product to fit seamlessly into tight spaces or crowded circuit layouts.

Length: 7.5 mm

Compact length facilitates easy integration and placement within electronic systems.

Terminal Form: GULL WING

Gull wing terminals offer secure soldering connections and reliable electrical contact.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage ensures consistent performance and operation under standard conditions.

Turn-on Time: 250 us

Fast turn-on time enhances responsiveness and efficiency in driving peripheral devices.

Terminal Pitch: 1 mm

Standard terminal pitch allows for compatibility with common circuit board layouts and connections.

Nominal Output Peak Current Limit: 7.4 A

High peak current limit capability supports demanding applications and devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type enables compatibility with a variety of peripheral devices and systems.

Turn-off Time: 270 us

Quick turn-off time aids in precise control and operation of connected peripherals.

Output Current Flow Direction: SINK

Sink output current flow direction ensures proper handling and control of electrical currents within the system.

Technical Specifications

Peripheral Drivers BTS5215LXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G12

Length:

7.5 mm

No. of Functions:

2

No. of Terminals:

12

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

7.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.6 mm

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

270 us

Turn-on Time:

250 us

Width:

6.4 mm

Trade Compliance

BTS5215LXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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