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BTS500851TMAATMA1

Infineon Technologies

BTS500851TMAATMA1 by Infineon Technologies

BTS500851TMAATMA1 by Infineon Technologies is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has a max supply voltage of 58V and nominal output peak current limit of 11.1A. This small outline heat sink package is ideal for applications requiring a buffer or inverter based peripheral driver with sink output flow direction.

Median Price

$6.945

Lifecycle Status

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19

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1k+

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Chip1Stop

Japan . 1 parts In-Stock

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$6.450

100+ parts

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1

$6.450

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Farnell

UK . 88 parts In-Stock

1+ parts

$7.440

100+ parts

$4.620

1k+ parts

$4.020

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88

$7.440

$4.620

$4.020

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Element14

Singapore . 5,650 parts In-Stock

1+ parts

$8.080

100+ parts

$6.047

1k+ parts

$5.265

10k+ parts

-

5,650

$8.080

$6.047

$5.265

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Mouser Electronics

USA . 3,815 parts In-Stock

1+ parts

$8.640

100+ parts

-

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$4.330

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3,815

$8.640

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$4.330

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Verical

USA . 7,000 parts In-Stock

1+ parts

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$3.893

10k+ parts

$3.827

7,000

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$3.893

$3.827

Arrow

USA . 5,000 parts In-Stock

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$3.874

10k+ parts

$3.744

5,000

-

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$3.874

$3.744

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.245

100+ parts

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300

$5.245

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Digiode

USA . 957 parts In-Stock

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$5.406

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957

$5.406

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Maritex

Poland . 29,450 parts In-Stock

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$8.424

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29,450

$8.424

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Chip Stock

USA . 50,500 parts In-Stock

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Semtec, LLC

USA . 3,000 parts In-Stock

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NAC Semi

USA . 3,000 parts In-Stock

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$6.460

10k+ parts

$5.970

3,000

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$6.460

$5.970

Vyrian

USA . 2,614 parts In-Stock

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2,614

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VNN

France . 2,524 parts In-Stock

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2,524

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Avant Electronics Limited

UK . 1,000 parts In-Stock

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1,000

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Rutronik

Germany . 1,000 parts In-Stock

1+ parts

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$3.850

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1,000

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$3.850

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Bristol Electronics

USA . 314 parts In-Stock

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314

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Extreme Components

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Rotakorn

Sweden . 3 parts In-Stock

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3

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Corohmni

South Africa . 7 parts In-Stock

1+ parts

$2.504

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7

$2.504

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Modulus Dynamics

Lithuania . 2,079 parts In-Stock

1+ parts

$2.533

100+ parts

$2.432

1k+ parts

$2.330

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-

2,079

$2.533

$2.432

$2.330

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$3.203

100+ parts

$3.043

1k+ parts

$3.043

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450

$3.203

$3.043

$3.043

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Ampacity Inc.

Singapore . 3,271 parts In-Stock

1+ parts

$3.290

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3,271

$3.290

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Semicontronic

India . 3,145 parts In-Stock

1+ parts

$3.290

100+ parts

$3.208

1k+ parts

$3.191

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3,145

$3.290

$3.208

$3.191

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Continental Prestige Electronics

USA . 3,122 parts In-Stock

1+ parts

$4.935

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$4.836

3,122

$4.935

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$4.836

Corphita

USA . 858 parts In-Stock

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$5.121

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858

$5.121

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Netroflash

USA . 1,000 parts In-Stock

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$5.245

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$5.245

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Component Stockers USA

USA . 51 parts In-Stock

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$6.850

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51

$6.850

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Aztec Data Supply Inc.

USA . 4,801 parts In-Stock

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$11.038

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4,801

$11.038

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Microchip USA

USA . 2,722 parts In-Stock

1+ parts

$25.160

100+ parts

$25.010

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$24.930

10k+ parts

$24.850

2,722

$25.160

$25.010

$24.930

$24.850

Perfect Parts

USA . 14,571 parts In-Stock

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Lixinc

USA . 14,199 parts In-Stock

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Authorized Procurement Solutions

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RC Electronics

USA . 9,107 parts In-Stock

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$5.080

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$4.640

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$4.500

9,107

-

$5.080

$4.640

$4.500

Epart123

USA . 5,000 parts In-Stock

1+ parts

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$31.730

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$31.730

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$31.730

GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,418 parts In-Stock

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Robosynatics

Brazil . 3,025 parts In-Stock

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$4.848

1k+ parts

$4.749

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$4.749

3,025

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$4.848

$4.749

$4.749

Lucentia Tech

USA . 3,025 parts In-Stock

1+ parts

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100+ parts

$4.848

1k+ parts

$4.749

10k+ parts

$4.749

3,025

-

$4.848

$4.749

$4.749

Futuretech Components

Singapore . 1,000 parts In-Stock

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Overview

Unlock new possibilities with the BTS500851TMAATMA1 by Infineon Technologies, a cutting-edge peripheral driver designed to enhance your applications. Infineon Technologies is renowned for its top-notch quality and innovation in the industry, ensuring reliable performance and durability. Whether you're looking to protect against transient events or manage overcurrent situations, this product offers built-in protections that deliver peace of mind. With a compact package style and easy surface-mount installation, this driver is versatile and efficient. Elevate your projects with the BTS500851TMAATMA1 and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ensuring it can withstand rugged environments.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and streamlining the manufacturing process.

Maximum Supply Voltage: 58 V

With a high maximum supply voltage of 58V, this peripheral driver can handle demanding power requirements, making it versatile for various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the peripheral driver and connected components are safeguarded against various electrical faults, enhancing reliability and longevity.

No. of Terminals: 7

Having 7 terminals provides flexibility in connections and allows for interfacing with multiple devices, making it suitable for complex electronic systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with heat sink/slug design helps in efficient heat dissipation, preventing overheating and ensuring stable performance.

Minimum Supply Voltage: 5 V

The low minimum supply voltage requirement of 5V ensures compatibility with a wide range of power sources and makes it energy-efficient.

Terminal Finish: TIN

The terminal finish of TIN provides good electrical conductivity and corrosion resistance, maintaining signal integrity and longevity.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and reduces the chance of errors during installation.

Maximum Seated Height: 4.5 mm

The low maximum seated height allows for compact integration within electronic devices, saving space and enabling sleek designs.

Width: 9.25 mm

The moderate width of 9.25mm ensures easy PCB layout integration and allows for efficient use of space within electronic assemblies.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures robust soldering connections during manufacturing, reducing the risk of solder joint failures.

Length: 10 mm

The compact length of 10mm contributes to the overall small form factor of the peripheral driver, enabling versatile mounting options in electronic systems.

Technology: MOS

Employing MOS technology provides high-speed operation, low power consumption, and excellent switching characteristics, enhancing overall performance and efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection processes during assembly, ensuring reliable electrical connections and quality control.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V provides a balanced operating range for various electronic applications, offering compatibility and flexibility in power requirements.

Turn-on Time: 400 us

The fast turn-on time of 400us ensures quick response and minimal delay in activating connected devices, enhancing overall system performance.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting on PCBs, optimizing space utilization and enabling compact electronic designs.

Nominal Output Peak Current Limit: 11.1 A

The high nominal output peak current limit of 11.1A allows for driving demanding loads and ensures reliable operation under heavy electrical loads.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter-based peripheral driver offers versatility in signal conditioning and interfacing, making it suitable for a wide range of applications.

Turn-off Time: 110 us

The quick turn-off time of 110us ensures efficient switching and response in deactivating connected devices, improving system reliability and performance.

Output Current Flow Direction: SINK

The output current flow direction of sink allows for efficient control and regulation of current flow to connected devices, ensuring proper functionality and protection.

Technical Specifications

Peripheral Drivers BTS500851TMAATMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Additional Features:

REVERSE BATTERY PROTECTION; SEATED HGT -CALCULATED; SEATED HGT-NOM

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

7

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

11.1 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

4.5 mm

Maximum Supply Voltage:

58 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

110 us

Turn-on Time:

400 us

Width:

9.25 mm

Trade Compliance

BTS500851TMAATMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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