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BTS50085-1TMB

Infineon Technologies

BTS50085-1TMB by Infineon Technologies

BTS50085-1TMB by Infineon is a MOS peripheral driver with 24V nominal voltage and 58V max supply voltage. It offers built-in protections for transient, overvoltage, thermal, and undervoltage conditions. Ideal for automotive applications due to AEC-Q100 screening level and sink output current flow direction.

Median Price

$7.945

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1 parts In-Stock

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$7.010

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Mouser Electronics

USA . 1,993 parts In-Stock

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$8.880

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$5.130

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$4.050

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Distributors (In-Stock)

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Digiode

USA . 204 parts In-Stock

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$6.660

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VNN

France . 4,133 parts In-Stock

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Semtec, LLC

USA . 1,600 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 650 parts In-Stock

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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NexGen Digital

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Distributors (Availability)

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Corohmni

South Africa . 398 parts In-Stock

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$4.232

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398

$4.232

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Modulus Dynamics

Lithuania . 2,564 parts In-Stock

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$5.456

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$5.238

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$5.020

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Semicontronic

India . 801 parts In-Stock

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$5.960

100+ parts

$5.811

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$5.781

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801

$5.960

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Ampacity Inc.

Singapore . 714 parts In-Stock

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$5.960

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Corphita

USA . 966 parts In-Stock

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$6.309

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$9.782

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$9.293

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$9.293

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$9.782

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$9.293

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Futuretech Components

Singapore . 16,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,263 parts In-Stock

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Continental Prestige Electronics

USA . 6,754 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,675 parts In-Stock

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Perfect Parts

USA . 4,168 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Argo Parts USA

USA . 3,607 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Lixinc

USA . 2,274 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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Overview

Elevate your projects to the next level with the BTS50085-1TMB by Infineon Technologies. Manufactured with precision and expertise, this Peripheral Driver offers unparalleled quality and reliability. With built-in protections against transient, over voltage, thermal, and under voltage issues, you can rest assured that your devices are safe and secure. Ideal for a wide range of applications, this product delivers exceptional performance and efficiency. Experience the value and benefits that only Infineon Technologies can provide with the BTS50085-1TMB. Upgrade your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the peripheral driver, ensuring long-term reliability.

Maximum Supply Voltage: 58 V

High maximum supply voltage allows for flexibility in various applications, accommodating different power requirements.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making this peripheral driver suitable for automotive applications.

Built-in Protections: TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety of the overall system by preventing damage from transient events, voltage spikes, overheating, and low voltage conditions.

Power Supplies (V): 24

24V power supply is commonly used in many industrial and automotive applications, making this peripheral driver compatible with a wide range of systems.

No. of Terminals: 7

Having 7 terminals provides flexibility in connecting to different components and peripherals, allowing for versatile system integration.

Terminal Finish: TIN

TIN terminal finish ensures good conductivity and corrosion resistance, maintaining stable connections for efficient operation.

Nominal Output Peak Current Limit: 11.1 A

High output peak current limit allows for driving power-hungry components or peripherals, making this peripheral driver suitable for demanding applications.

Technical Specifications

Peripheral Drivers BTS50085-1TMB attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PZFM-T7

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

7

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

11.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.15,.18,50TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

24

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

58 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

24 V

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Turn-off Time:

400 us

Turn-on Time:

110 us

Trade Compliance

BTS50085-1TMB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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