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ULN2003ANE3

Texas Instruments

ULN2003ANE3 by Texas Instruments

ULN2003ANE3 by Texas Instruments is a 7-bit buffer/inverter peripheral driver with open-collector output polarity. It operates b/w -20°C to 70°C, supports a nominal voltage of 50V, and has built-in transient protections. Ideal for applications requiring sink current flow direction in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,255 parts In-Stock

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Digiode

USA . 3,626 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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Parana Technologies

USA . 1,257 parts In-Stock

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$1.815

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$2.369

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$1.815

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$2.369

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ChromeModa Solutions

Germany . 824 parts In-Stock

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$2.039

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$1.672

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824

$2.039

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IDEA Electronic Components Group

UK . 240 parts In-Stock

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$2.039

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$1.835

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$2.039

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$1.835

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$3.236

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$3.074

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$3.074

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40

$3.236

$3.074

$3.074

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Corohmni

South Africa . 57 parts In-Stock

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$11.319

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$11.319

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AZTECH Wire

Italy . 648 parts In-Stock

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$11.857

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One Stop Electronics

USA . 799 parts In-Stock

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$14.500

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$14.500

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Ampacity Inc.

Singapore . 296 parts In-Stock

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$22.500

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Semicontronic

India . 409 parts In-Stock

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$24.500

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$23.888

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$23.765

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Continental Prestige Electronics

USA . 3,955 parts In-Stock

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Corphita

USA . 3,737 parts In-Stock

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Argo Parts USA

USA . 3,094 parts In-Stock

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DigiPath Technology Company

USA . 365 parts In-Stock

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$1.838

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$1.838

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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$0.469

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$0.469

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$0.469

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$0.469

Bastille Electronics

Australia . 37 parts In-Stock

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Overview

Unleash the power of your electronic projects with the ULN2003ANE3 by Texas Instruments, a top-quality peripheral driver that offers unmatched performance and reliability. Designed with built-in transient protections, this versatile component is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With its inverted output polarity and sink current flow direction, the ULN2003ANE3 provides customers with a seamless and efficient solution for their driver needs. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Built-in Protections: TRANSIENT

The built-in transient protection helps safeguard the connected devices from sudden voltage spikes or surges, ensuring reliable performance.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components or devices, enhancing flexibility in usage.

Technology: BIPOLAR

The bipolar technology offers stable and reliable operation, making this peripheral driver a dependable choice for various applications.

Nominal Supply Voltage: 50 V

With a nominal supply voltage of 50V, this peripheral driver can handle a wide range of power requirements, suitable for diverse applications.

Technical Specifications

Peripheral Drivers ULN2003ANE3 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

7

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDIP-T16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

50 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ULN2003ANE3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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