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AUIR3313STRL

Infineon Technologies

AUIR3313STRL by Infineon Technologies

AUIR3313STRL by Infineon Technologies is a peripheral driver with a max supply voltage of 32V and built-in protections for transient, over current, and thermal issues. It has a max output current of 23A and is suitable for applications requiring interface IC type buffer or inverter based peripheral drivers. The package style is small outline with heat sink/slug, making it ideal for compact designs.

Median Price

$3.204

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.204

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10

$3.204

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VNN

France . 23,792 parts In-Stock

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23,792

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Cyclops Electronics Ltd

UK . 6,225 parts In-Stock

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6,225

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Chip Stock

USA . 4,700 parts In-Stock

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4,700

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Atlantic Semiconductor

USA . 2,244 parts In-Stock

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2,244

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Bristol Electronics

USA . 1,984 parts In-Stock

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Digiode

USA . 870 parts In-Stock

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870

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Martec Srl

Italy . 764 parts In-Stock

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764

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Vyrian

USA . 359 parts In-Stock

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359

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Classic Components Corporation

USA . 122 parts In-Stock

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Cogito LLC

Ukraine . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,100 parts In-Stock

1+ parts

$3.204

100+ parts

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1k+ parts

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$3.139

6,100

$3.204

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$3.139

Argo Parts USA

USA . 1,864 parts In-Stock

1+ parts

$3.204

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1,864

$3.204

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Modulus Dynamics

Lithuania . 2,936 parts In-Stock

1+ parts

$3.418

100+ parts

$3.281

1k+ parts

$3.145

10k+ parts

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2,936

$3.418

$3.281

$3.145

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$4.770

100+ parts

$4.341

1k+ parts

$3.911

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3,000

$4.770

$4.341

$3.911

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Semicontronic

India . 227 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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227

$5.500

$5.362

$5.335

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Aztec Data Supply Inc.

USA . 227 parts In-Stock

1+ parts

$10.504

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227

$10.504

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Corohmni

South Africa . 615 parts In-Stock

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$12.869

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615

$12.869

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AZTECH Wire

Italy . 359 parts In-Stock

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$19.606

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359

$19.606

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Ampacity Inc.

Singapore . 212 parts In-Stock

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$21.500

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212

$21.500

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RC Electronics

USA . 32,504 parts In-Stock

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$2.640

1k+ parts

$2.410

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$2.340

32,504

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$2.640

$2.410

$2.340

Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Lixinc

USA . 7,277 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,518 parts In-Stock

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Perfect Parts

USA . 3,295 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,012 parts In-Stock

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Microchip USA

USA . 347 parts In-Stock

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347

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Kepictronics

USA . 300 parts In-Stock

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Corphita

USA . 250 parts In-Stock

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250

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Overview

Experience superior quality and reliability with the AUIR3313STRL peripheral driver by Infineon Technologies. This innovative product offers built-in protections against transient events, overcurrent situations, and thermal issues, ensuring maximum safety and performance. Ideal for a wide range of applications, this compact device provides a seamless interface for buffer or inverter based systems. Trust in the value and benefits that this high-quality product brings to your projects, delivering unparalleled efficiency and peace of mind. Step up your game with the AUIR3313STRL and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 32 V

Can handle high voltage inputs, making it suitable for a wide range of applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring quality for automotive applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Enhanced safety features protect the driver and connected components from damage due to transient events, over current conditions, and excessive heat.

Power Supplies (V): 6/26

Supports a range of power supply voltages, providing flexibility in different operating environments.

No. of Terminals: 4

Optimal number of terminals for connecting to external components, simplifying the wiring process.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact package design with integrated heat sink for efficient heat dissipation, ideal for space-constrained applications.

Minimum Supply Voltage: 6 V

Can operate with low supply voltages, making it suitable for a variety of power sources.

Terminal Finish: MATTE TIN OVER NICKEL

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: SINGLE

Simplifies installation and connection to the circuit, reducing potential errors and improving overall reliability.

Maximum Seated Height: 4.83 mm

Low profile design fits easily in space-constrained environments, allowing for versatile installation options.

Width: 9.08 mm

Compact width facilitates installation in tight spaces, ideal for applications with limited room for components.

Maximum Time At Peak Reflow Temperature (s): 30

Enables efficient soldering process during manufacturing, ensuring reliable connections and consistent performance.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance allows for robust soldering process, ensuring strong connections and durability.

Length: 10.16 mm

Optimal length for installation in compact spaces, providing flexibility in design and placement.

Maximum Output Current: 23 A

High output current capacity for driving peripheral components, making it suitable for applications with demanding power requirements.

Terminal Form: GULL WING

Specific terminal form for easy and secure connection to the circuit board, ensuring reliable electrical connections.

Nominal Supply Voltage: 14 V

Nominal supply voltage for consistent and stable operation in various operating conditions.

Turn-on Time: 80 us

Fast turn-on time for quick response to input signals, ensuring efficient operation and control of peripheral devices.

Terminal Pitch: 1.7 mm

Optimal terminal pitch for ease of installation and compatibility with standard soldering processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Flexible interface IC type for driving peripheral devices, providing compatibility with a wide range of applications.

Turn-off Time: 200 us

Fast turn-off time for efficient control and management of peripheral components, ensuring precise operation.

Output Current Flow Direction: SINK

Sink output current flow direction for driving components that require current sinking, providing compatibility with various loads.

Technical Specifications

Peripheral Drivers AUIR3313STRL attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

10.16 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Maximum Output Current:

23 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/26

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.83 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

200 us

Turn-on Time:

80 us

Width:

9.08 mm

Trade Compliance

AUIR3313STRL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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