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BTS5210G

Infineon Technologies

BTS5210G by Infineon Technologies

BTS5210G by Infineon is a MOS technology peripheral driver with 2 functions, operating at 5.5-40V. It offers built-in protections against transient, over current, and over voltage. Ideal for automotive applications due to AEC-Q100 screening level and small outline package style.

Median Price

$2.186

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 20,481 parts In-Stock

1+ parts

$2.610

100+ parts

$1.580

1k+ parts

$1.410

10k+ parts

$1.320

20,481

$2.610

$1.580

$1.410

$1.320

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.763

1k+ parts

$1.623

10k+ parts

$1.555

5,000

-

$1.763

$1.623

$1.555

Distributors (In-Stock)

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Digiode

USA . 823 parts In-Stock

1+ parts

$2.603

100+ parts

-

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823

$2.603

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Bristol Electronics

USA . 588 parts In-Stock

1+ parts

$3.000

100+ parts

$1.860

1k+ parts

$1.125

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-

588

$3.000

$1.860

$1.125

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Maritex

Poland . 17,337 parts In-Stock

1+ parts

$3.113

100+ parts

$1.709

1k+ parts

$1.171

10k+ parts

$1.058

17,337

$3.113

$1.709

$1.171

$1.058

TME

Poland . 2,120 parts In-Stock

1+ parts

$3.730

100+ parts

$1.950

1k+ parts

$1.480

10k+ parts

$1.440

2,120

$3.730

$1.950

$1.480

$1.440

Astute Electronics Inc

. 27,500 parts In-Stock

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27,500

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Infinite Electronics LLP

India . 13,458 parts In-Stock

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Chip Stock

USA . 6,845 parts In-Stock

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6,845

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ComSIT Distribution GmbH

Germany . 6,781 parts In-Stock

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Vyrian

USA . 5,685 parts In-Stock

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5,685

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Rutronik

Germany . 5,000 parts In-Stock

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$1.450

5,000

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$1.450

VNN

France . 3,048 parts In-Stock

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3,048

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LIBRA Elektronik GmbH

Germany . 1,886 parts In-Stock

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1,886

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Cyclops Electronics Ltd

UK . 1,407 parts In-Stock

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1,407

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Sensible Micro Corp

USA . 46 parts In-Stock

1+ parts

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100+ parts

$1.073

1k+ parts

$0.990

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46

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$1.073

$0.990

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Nova Conductors

Japan . 34 parts In-Stock

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34

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,571 parts In-Stock

1+ parts

$1.200

100+ parts

-

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15,571

$1.200

-

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Semicontronic

India . 15,383 parts In-Stock

1+ parts

$1.200

100+ parts

$1.170

1k+ parts

$1.164

10k+ parts

-

15,383

$1.200

$1.170

$1.164

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Corphita

USA . 867 parts In-Stock

1+ parts

$2.466

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867

$2.466

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CoreStaff

Japan . 5,000 parts In-Stock

1+ parts

$2.912

100+ parts

$1.136

1k+ parts

$1.097

10k+ parts

-

5,000

$2.912

$1.136

$1.097

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$10.582

100+ parts

$10.053

1k+ parts

$10.053

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600

$10.582

$10.053

$10.053

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Corohmni

South Africa . 85 parts In-Stock

1+ parts

$10.902

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85

$10.902

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Modulus Dynamics

Lithuania . 1,015 parts In-Stock

1+ parts

$13.011

100+ parts

$12.491

1k+ parts

$11.970

10k+ parts

-

1,015

$13.011

$12.491

$11.970

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Perfect Parts

USA . 179,675 parts In-Stock

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S.R.D Solutions

India . 52,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 12,500 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Component Connect

USA . 3,623 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,310 parts In-Stock

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Assy Fe

Spain . 1,742 parts In-Stock

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1,742

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Alle Elektronik GmbH

Germany . 1,540 parts In-Stock

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Microchip USA

USA . 1,061 parts In-Stock

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Continental Prestige Electronics

USA . 838 parts In-Stock

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838

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Kepictronics

USA . 800 parts In-Stock

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800

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Futuretech Components

Singapore . 740 parts In-Stock

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740

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Argo Parts USA

USA . 618 parts In-Stock

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618

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Bastille Electronics

Australia . 600 parts In-Stock

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600

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Infinite Electronics LLP (Excess)

. 571 parts In-Stock

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571

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Overview

Infineon PROFET™ Smart High-Side Switches are placed between the supply and load to control the application. These highly integrated high-side switches incorporate a broad range of smart features like diagnosis and protection. PROFET switches consist of a DMOS power transistor and CMOS logic circuitry for complete built-in protection against overload, short-circuit, excessive temperature, ground loss, power supply loss, and electrostatic discharge (ESD).

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

This feature allows for easy installation on circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 40 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power inputs, offering flexibility for various applications.

No. of Functions: 2

Having multiple functions in one device saves space and simplifies the overall design of the system.

Screening Level: AEC-Q100

This automotive-grade screening level ensures high-quality performance in harsh environments, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and easy to integrate into existing circuit layouts.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE, THERMAL, UNDER VOLTAGE

These advanced protections safeguard the device and connected components from damage, ensuring reliable operation in various conditions.

Power Supplies (V): 12

The nominal supply voltage of 12V makes this peripheral driver compatible with standard power sources, simplifying integration into existing systems.

No. of Terminals: 14

The ample number of terminals allows for versatile connectivity options, accommodating different wiring configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables a compact overall system design.

Minimum Supply Voltage: 5.5 V

With a low minimum supply voltage, this peripheral driver can operate efficiently even in low-power situations.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance even in extreme heat conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this peripheral driver to function effectively in cold environments.

Terminal Finish: TIN

The terminal finish of tin provides stable and reliable contact points for external connections.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and allows for easy integration into different systems.

Maximum Seated Height: 1.75 mm

The low profile of this peripheral driver makes it suitable for applications with limited space.

Width: 4 mm

The compact width of 4mm enables easy placement and integration into tight spaces.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this peripheral driver is suitable for automated soldering processes, ensuring efficient and reliable assembly.

Length: 8.75 mm

The moderate length of 8.75mm provides a good balance between space efficiency and ease of handling during installation.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this peripheral driver can withstand the demanding conditions of automotive environments.

Technology: MOS

The MOS technology used in this peripheral driver offers high performance and efficiency, making it suitable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and easy installation onto circuit boards.

Nominal Supply Voltage: 12 V

This nominal supply voltage ensures compatibility with standard power sources, making integration seamless.

Turn-on Time: 250 us

The fast turn-on time of 250 microseconds allows for quick response and efficient operation in dynamic systems.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm enables high-density mounting and space-efficient design.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that this peripheral driver has moderate sensitivity to moisture, suitable for most environments.

Nominal Output Peak Current Limit: 8.5 A

The high peak current limit of 8.5A allows this peripheral driver to handle demanding loads and provide stable performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface IC type offers flexibility in connecting and controlling peripheral devices, making it adaptable to various system requirements.

Turn-off Time: 270 us

The quick turn-off time of 270 microseconds enhances the responsiveness and efficiency of this peripheral driver in dynamic applications.

Output Current Flow Direction: SINK

The sink output current flow direction ensures compatibility with devices that require current sinking, offering versatility in system integration.

Technical Specifications

Peripheral Drivers BTS5210G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

8.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

270 us

Turn-on Time:

250 us

Width:

4 mm

Trade Compliance

BTS5210G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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