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BTS7960P

Infineon Technologies

BTS7960P by Infineon Technologies

BTS7960P by Infineon Technologies is a MOS technology peripheral driver with 7 terminals. It offers built-in protections for transient, over current, over voltage, thermal, and under voltage. With a max supply voltage of 27.5V and nominal output peak current limit of 62A, it is ideal for applications requiring a half bridge based peripheral driver with source and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,658 parts In-Stock

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7,658

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VNN

France . 3,650 parts In-Stock

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3,650

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Digiode

USA . 334 parts In-Stock

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334

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 960 parts In-Stock

1+ parts

$0.500

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960

$0.500

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Aztec Data Supply Inc.

USA . 4,394 parts In-Stock

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$4.210

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4,394

$4.210

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$5.914

100+ parts

$5.619

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$5.619

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20

$5.914

$5.619

$5.619

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Semicontronic

India . 1,191 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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1,191

$7.500

$7.312

$7.275

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Corohmni

South Africa . 9 parts In-Stock

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$8.181

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9

$8.181

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Modulus Dynamics

Lithuania . 2,276 parts In-Stock

1+ parts

$11.418

100+ parts

$10.961

1k+ parts

$10.505

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2,276

$11.418

$10.961

$10.505

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AZTECH Wire

Italy . 706 parts In-Stock

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$14.665

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706

$14.665

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Continental Prestige Electronics

USA . 5,762 parts In-Stock

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5,762

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A-Z Elektronik GmbH

Germany . 1,865 parts In-Stock

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1,865

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Corphita

USA . 518 parts In-Stock

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518

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$0.148

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$0.148

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$0.148

300

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$0.148

$0.148

$0.148

Argo Parts USA

USA . 265 parts In-Stock

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265

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Microchip USA

USA . 231 parts In-Stock

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231

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unleash the power of your projects with the BTS7960P by Infineon Technologies, a top-tier manufacturer known for delivering high-quality products. This peripheral driver is designed to provide reliable and efficient performance, making it perfect for a wide range of applications. From robotics to automotive systems, this versatile component offers built-in protections for peace of mind and exceptional value for customers. Upgrade your creations with the BTS7960P and experience the benefits of seamless operation and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Maximum Supply Voltage: 27.5 V

Allows for compatibility with a wide range of input power sources, making the peripheral driver versatile in different applications.

Package Shape: RECTANGULAR

Facilitates easy integration into electronic circuits and systems, simplifying installation and connection processes.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Ensures the safety and reliability of connected devices by safeguarding against various potential risks and hazards.

No. of Terminals: 7

Provides ample connection points for interfacing with external devices or circuits, offering flexibility in the setup and configuration of the peripheral driver.

Package Style (Meter): FLANGE MOUNT

Enables secure mounting and positioning of the peripheral driver within a system, minimizing the risk of dislodgment or damage during operation.

Minimum Supply Voltage: 5.5 V

Supports operation at lower input voltage levels, enhancing the compatibility and adaptability of the peripheral driver in diverse environments.

Terminal Position: ZIG-ZAG

Facilitates efficient routing and organization of connecting wires or cables, promoting neat and orderly cable management within the system setup.

Technology: MOS

Utilizes efficient MOS technology for high-performance operation and energy efficiency, ensuring optimal functionality and responsiveness of the peripheral driver.

Terminal Form: THROUGH-HOLE

Enables secure and reliable connections with external components or devices, reducing the risk of loose connections or signal interference.

Nominal Supply Voltage: 8 V

Indicates the standard operating voltage for the peripheral driver, providing a stable power source for consistent performance and reliability.

Turn-on Time: 25.4 us

Offers fast activation and response times, allowing for quick and efficient control of connected devices or peripherals.

Nominal Output Peak Current Limit: 62 A

Supports high current output capabilities, making the peripheral driver suitable for driving various types of loads or components with significant power requirements.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Utilizes a half-bridge interface IC design for improved efficiency and performance, enabling precise and reliable control of connected peripherals or devices.

Turn-off Time: 16 us

Provides quick deactivation and response times, ensuring prompt shutdown or adjustment of connected devices or peripherals as needed.

Output Current Flow Direction: SOURCE AND SINK

Supports bidirectional current flow capabilities, allowing for versatile control and operation of connected devices with different power requirements.

Technical Specifications

Peripheral Drivers BTS7960P attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

62 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage:

27.5 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

8 V

Surface Mount:

NO

Technology:

MOS

Terminal Form:

Terminal Position:

ZIG-ZAG

Turn-off Time:

16 us

Turn-on Time:

25.4 us

Trade Compliance

BTS7960P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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