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BTS711L1

Infineon Technologies

BTS711L1 by Infineon Technologies

BTS711L1 by Infineon Technologies is a peripheral driver with a max supply voltage of 34V. It has built-in protections for transient, over current, over voltage, thermal, and under voltage conditions. This small outline MOS technology driver is commonly used as a buffer or inverter based peripheral driver in various applications.

Median Price

$6.342

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,622 parts In-Stock

1+ parts

$6.050

100+ parts

$3.880

1k+ parts

$3.290

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1,622

$6.050

$3.880

$3.290

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RS (Exports)

UK . 841 parts In-Stock

1+ parts

$6.635

100+ parts

$5.177

1k+ parts

$3.937

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841

$6.635

$5.177

$3.937

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Distributors (In-Stock)

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Greenchips

USA . 191 parts In-Stock

1+ parts

$2.853

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$2.717

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$2.587

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$2.335

191

$2.853

$2.717

$2.587

$2.335

TME

Poland . 856 parts In-Stock

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$5.710

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$3.710

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$3.560

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$5.710

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Digiode

USA . 615 parts In-Stock

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$6.108

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Astute Electronics Inc

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ComSIT Distribution GmbH

Germany . 6,080 parts In-Stock

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VNN

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Vyrian

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ComSIT USA

USA . 725 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 191 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 58 parts In-Stock

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Netsource Technology, Inc.

USA . 40 parts In-Stock

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Classic Components Corporation

USA . 39 parts In-Stock

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Whistler Technology

UK . 38 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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Bristol Electronics

USA . 34 parts In-Stock

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Atlantic Semiconductor

USA . 34 parts In-Stock

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Elcom Components

USA . 23 parts In-Stock

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LittleDiode

UK . 13 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Huijzer Components

Netherlands . 5 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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Prism Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,118 parts In-Stock

1+ parts

$3.337

100+ parts

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4,118

$3.337

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Modulus Dynamics

Lithuania . 2,763 parts In-Stock

1+ parts

$3.482

100+ parts

$3.343

1k+ parts

$3.203

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2,763

$3.482

$3.343

$3.203

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Ampacity Inc.

Singapore . 1,712 parts In-Stock

1+ parts

$5.470

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$5.470

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Semicontronic

India . 1,629 parts In-Stock

1+ parts

$5.640

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$5.499

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$5.471

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1,629

$5.640

$5.499

$5.471

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Corphita

USA . 665 parts In-Stock

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$5.787

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665

$5.787

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$7.790

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$7.400

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$7.400

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5,000

$7.790

$7.400

$7.400

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Corohmni

South Africa . 163 parts In-Stock

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$12.553

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Perfect Parts

USA . 46,253 parts In-Stock

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Lixinc

USA . 11,924 parts In-Stock

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Kepictronics

USA . 11,800 parts In-Stock

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GreenTree Electronics

Israel . 7,766 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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$2.919

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$2.919

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$2.919

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$2.919

$2.919

$2.919

Continental Prestige Electronics

USA . 3,901 parts In-Stock

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Metaverse IC Inc.

Canada . 3,623 parts In-Stock

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Argo Parts USA

USA . 2,467 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,626 parts In-Stock

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1,626

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Alle Elektronik GmbH

Germany . 1,084 parts In-Stock

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1,084

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Allen Electronics Distributors

USA . 453 parts In-Stock

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$4.386

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453

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$4.386

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Bastille Electronics

Australia . 98 parts In-Stock

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98

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Cyclops Electronics Ltd (Excess)

UK . 69 parts In-Stock

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Assy Fe

Spain . 9 parts In-Stock

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Overview

Discover the power of the BTS711L1 by Infineon Technologies, a top-quality peripheral driver that will take your projects to new heights. With its advanced technology and built-in protections against transients, overvoltage, and more, this compact device is perfect for a wide range of applications. From automotive systems to industrial automation, the BTS711L1 delivers reliable performance and precise control. Its small outline package and dual terminal position ensure easy integration into any design. Trust Infineon Technologies, a leading manufacturer known for their innovation and expertise. Upgrade your projects with the BTS711L1 and experience the value, benefits, and advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances durability and makes the peripheral driver resistant to various environmental conditions, making it a reliable choice.

Surface Mount: YES

The surface mount capability simplifies the installation process and allows for efficient and space-saving integration, making it convenient for various applications.

Maximum Supply Voltage: 34 V

With a maximum supply voltage of 34V, this peripheral driver can handle a wide range of power inputs, making it versatile and suitable for different voltage requirements.

No. of Functions: 4

Offering four functions in a single device provides flexibility and efficiency in driving peripheral components, reducing the need for multiple drivers and simplifying circuit design.

Screening Level: AEC-Q100

Compliant with the AEC-Q100 screening level, this peripheral driver meets stringent automotive and industrial standards, ensuring high reliability and performance in critical applications.

Package Shape: RECTANGULAR

The rectangular shape of the package enables easy integration into various circuit board layouts, allowing for efficient space utilization and simplified assembly.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The integration of multiple built-in protections safeguards the peripheral driver and connected components from transient events, overloads, voltage fluctuations, thermal issues, and under-voltage situations, enhancing the overall reliability and longevity of the system.

Power Supplies (V): 5/34

Supporting power supplies ranging from 5V to 34V, this peripheral driver can adapt to a wide range of voltage requirements, making it suitable for various applications with different power sources.

No. of Terminals: 20

The twenty terminal configuration allows for easy connection and interfacing with external components, facilitating hassle-free integration into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact form factor, enabling space-efficient integration and allowing for use in applications with limited board space.

Minimum Supply Voltage: 5 V

With a minimum supply voltage requirement of 5V, this peripheral driver can operate efficiently even in low voltage scenarios, making it versatile and compatible with a variety of power sources.

Terminal Finish: TIN

The use of tin as the terminal finish enhances the peripheral driver's electrical conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: DUAL

With a dual terminal position, this peripheral driver accommodates various pin assignment requirements, providing flexibility in circuit layout designs.

Maximum Seated Height: 2.65 mm

The low-profile maximum seated height enables the peripheral driver to be used in applications with height restrictions, allowing for compact and streamlined designs.

Width: 7.6 mm

The width of 7.6mm ensures a compact form factor, enabling space-efficient integration and contributing to the overall miniaturization of the circuit.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, this peripheral driver can withstand high-temperature soldering processes, ensuring reliable solder joint formation during PCB assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this peripheral driver can tolerate high-temperature soldering processes commonly used in PCB assembly, ensuring reliable and robust connections.

Length: 12.8 mm

The length of 12.8mm provides a compact form factor, allowing for space-efficient integration and contributing to overall circuit miniaturization.

Maximum Output Current: 0.01 A

The maximum output current of 0.01A allows for driving peripheral components within specified limits, ensuring optimal performance and preventing damage to connected devices.

Technology: MOS

Utilizing MOS technology ensures high-speed switching capabilities and low power consumption, making this peripheral driver suitable for applications where efficiency and speed are essential.

Terminal Form: GULL WING

The gull wing terminal form facilitates straightforward PCB mounting and soldering processes, ensuring secure and reliable connections for efficient circuit operation.

Nominal Supply Voltage: 12 V

With a nominal supply voltage of 12V, this peripheral driver is well-suited for applications requiring a stable and standardized power source.

Turn-on Time: 400 us

The quick turn-on time of 400 microseconds allows for rapid activation of the peripheral driver, enabling fast response times and efficient operation.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm simplifies PCB layout designs and allows for straightforward connections, ensuring ease of integration and facilitating efficient assembly processes.

Driver No. of Bits: 4

Offering four driver bits, this peripheral driver can handle complex control signals or drive multiple inputs, providing versatility and flexibility in diverse applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures that the peripheral driver can withstand moderate levels of moisture exposure during storage and assembly processes, maintaining its functionality and reliability.

Nominal Output Peak Current Limit: 4.4 A

With a nominal output peak current limit of 4.4A, this peripheral driver can handle high-current drive requirements, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver features an interface IC type that can function as either a buffer or inverter, providing compatibility and versatility in different circuit configurations.

Turn-off Time: 400 us

The quick turn-off time of 400 microseconds allows for fast deactivation of the peripheral driver, contributing to efficient and responsive circuit operation.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current makes this peripheral driver compatible with various types of loads, providing flexibility in driving different components and ensuring optimal performance.

Technical Specifications

Peripheral Drivers BTS711L1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

.01 A

Nominal Output Peak Current Limit:

4.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/34

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

400 us

Turn-on Time:

400 us

Width:

7.6 mm

Trade Compliance

BTS711L1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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