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TLE6220GP

Infineon Technologies

TLE6220GP by Infineon Technologies

TLE6220GP by Infineon is a 20-terminal MOS driver with built-in protections for transient, over current, and over voltage. Operating at 5V with a max output current of 3A, it's ideal for automotive applications due to its AEC-Q100 screening level and small outline package style. With a turn-on/off time of 10us and sink output flow direction, it offers reliable performance in harsh environments.

Median Price

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15

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Velocity Electronics

USA . 10,400 parts In-Stock

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Vyrian

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J2 Sourcing AB

Sweden . 800 parts In-Stock

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Digiode

USA . 265 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 260 parts In-Stock

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Holdelec - ElecDif-Pro

France . 260 parts In-Stock

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Classic Components Corporation

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Fibra_Brandt Electronic GMBH

Germany . 40 parts In-Stock

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Q Components

USA . 23 parts In-Stock

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Cyclops Electronics Ltd

UK . 17 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Modulus Dynamics

Lithuania . 1,391 parts In-Stock

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$8.829

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$8.476

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$8.123

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$8.829

$8.476

$8.123

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AZTECH Wire

Italy . 601 parts In-Stock

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$10.372

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Corohmni

South Africa . 312 parts In-Stock

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$10.882

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Semicontronic

India . 1,241 parts In-Stock

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$21.500

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$20.962

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$20.855

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Ampacity Inc.

Singapore . 890 parts In-Stock

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$35.500

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Andel Nordic

Denmark . 27 parts In-Stock

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$50.080

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$35.055

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S.R.D Solutions

India . 30,000 parts In-Stock

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Glotronic Ltd.

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Lixinc

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Futuretech Components

Singapore . 4,800 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 1,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,653 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Formix International (Excess)

India . 800 parts In-Stock

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Corphita

USA . 546 parts In-Stock

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USA . 325 parts In-Stock

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New Zealand . 50 parts In-Stock

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Overview

Unlock the full potential of your automotive applications with the TLE6220GP by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers top-quality peripheral drivers that offer built-in protections against transient events, over current, over voltage, and thermal issues. With a compact design and reliable performance, this product provides customers with the value and peace of mind they need for their projects. Whether you're working on automotive lighting systems or motor control units, the TLE6220GP is the perfect solution to drive your innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for automotive applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and reliability of the peripheral driver, protecting it from various faults and malfunctions.

Maximum Output Current: 3 A

With a maximum output current of 3 A, this peripheral driver can efficiently handle high current loads, making it suitable for a wide range of applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the peripheral driver can withstand extreme temperature conditions commonly encountered in automotive environments.

Turn-on Time: 10 us

The fast turn-on time of 10 us ensures quick response and operation of the peripheral driver, enhancing the overall performance of the system.

Technical Specifications

Peripheral Drivers TLE6220GP attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

3 A

Nominal Output Peak Current Limit:

4.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

3.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

11 mm

Trade Compliance

TLE6220GP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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