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TLE6215G

Infineon Technologies

TLE6215G by Infineon Technologies

TLE6215G by Infineon is a 2-function peripheral driver with built-in protections for transient, over current, and over voltage. It operates b/w -40 to 150°C, with a supply voltage range of 4.8-40V. Ideal for automotive applications due to its MOS technology and sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,202 parts In-Stock

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Digiode

USA . 578 parts In-Stock

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Nova Conductors

Japan . 70 parts In-Stock

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70

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Modulus Dynamics

Lithuania . 4,440 parts In-Stock

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$3.816

100+ parts

$3.663

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$3.511

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4,440

$3.816

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$3.511

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Aztec Data Supply Inc.

USA . 1,993 parts In-Stock

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$4.660

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$4.660

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AZTECH Wire

Italy . 805 parts In-Stock

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$5.989

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805

$5.989

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Corohmni

South Africa . 308 parts In-Stock

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$10.945

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308

$10.945

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Semicontronic

India . 1,277 parts In-Stock

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$24.500

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$23.888

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$23.765

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1,277

$24.500

$23.888

$23.765

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Ampacity Inc.

Singapore . 667 parts In-Stock

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$34.500

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Argo Parts USA

USA . 2,092 parts In-Stock

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Corphita

USA . 807 parts In-Stock

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Continental Prestige Electronics

USA . 714 parts In-Stock

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Kepictronics

USA . 570 parts In-Stock

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Microchip USA

USA . 127 parts In-Stock

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Bastille Electronics

Australia . 39 parts In-Stock

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Overview

Enhance your automotive electronics with the TLE6215G from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their products. The TLE6215G is a versatile peripheral driver that provides built-in protections for transient, over current, over voltage, and thermal issues. With a wide range of applications, this product offers exceptional value and benefits to customers looking for high-performance solutions. Upgrade your systems with the TLE6215G and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 40V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making this peripheral driver versatile.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections offer safety features to prevent damage from transient events, overcurrent, overvoltage, and overheating, increasing the longevity of the product and the connected components.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the driver to operate reliably in harsh environments, such as automotive or outdoor settings.

Technical Specifications

Peripheral Drivers TLE6215G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6.5/40

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

4.8 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-on Time:

40 us

Width:

7.6 mm

Trade Compliance

TLE6215G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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