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TLE6282G

Infineon Technologies

TLE6282G by Infineon Technologies

TLE6282G by Infineon is a 20-terminal peripheral driver with a max supply voltage of 60V and built-in under voltage protection. It features a small outline package style, gull wing terminal form, and operates as a half bridge-based driver for source and sink current flow direction. Ideal for applications requiring precise control in compact spaces.

Median Price

$7.301

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$1.863

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10

$1.863

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Maritex

Poland . 9,944 parts In-Stock

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$12.738

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9,944

$12.738

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Chip Stock

USA . 15,680 parts In-Stock

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15,680

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Cyclops Electronics Ltd

UK . 11,610 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Vyrian

USA . 1,864 parts In-Stock

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1,864

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AGACORP

USA . 1,000 parts In-Stock

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1,000

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Digiode

USA . 654 parts In-Stock

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Pegasus Components GmbH

Germany . 49 parts In-Stock

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Semtec, LLC

USA . 35 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,664 parts In-Stock

1+ parts

$1.863

100+ parts

$1.788

1k+ parts

$1.714

10k+ parts

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2,664

$1.863

$1.788

$1.714

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Continental Prestige Electronics

USA . 2,616 parts In-Stock

1+ parts

$1.863

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$1.826

2,616

$1.863

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$1.826

Argo Parts USA

USA . 2,338 parts In-Stock

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$1.863

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2,338

$1.863

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Netroflash

USA . 100 parts In-Stock

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$1.863

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100

$1.863

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Ampacity Inc.

Singapore . 1,778 parts In-Stock

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$20.500

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1,778

$20.500

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Andel Nordic

Denmark . 513 parts In-Stock

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$58.510

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$40.957

10k+ parts

$40.957

513

$58.510

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$40.957

$40.957

RC Electronics

USA . 47,378 parts In-Stock

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Perfect Parts

USA . 35,522 parts In-Stock

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Lixinc

USA . 14,421 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,078 parts In-Stock

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6,078

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Corphita

USA . 127 parts In-Stock

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Overview

Unleash the power of innovation with the TLE6282G by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-quality peripheral drivers that deliver exceptional performance and reliability. Ideal for a wide range of applications, this product offers unbeatable value, benefits, and advantages to customers seeking superior solutions. Experience seamless operation, advanced built-in protections, and unmatched efficiency with the TLE6282G. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the peripheral driver lightweight and durable, making it easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 60 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power inputs, allowing for versatile applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design that saves space and enables easy integration into different electronic systems.

Built-in Protections: UNDER VOLTAGE

The under voltage protection feature helps safeguard the peripheral driver and connected devices from damage due to sudden drops in voltage, ensuring reliable performance.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple components, increasing flexibility in circuit design and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the overall space efficiency of the product, making it ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 7.5 V

The low minimum supply voltage requirement ensures compatibility with a variety of power sources, making this peripheral driver versatile and easily adaptable.

Terminal Position: DUAL

Dual terminal position allows for more secure connections, reducing the risk of disconnection and ensuring stable operation in various operating conditions.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm contributes to a sleek and compact design, enabling this peripheral driver to fit into tight spaces without compromising performance.

Width: 7.6 mm

The narrow width of 7.6 mm makes the peripheral driver space-efficient, facilitating easier mounting and integration in electronic systems with limited space available.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this peripheral driver can withstand the reflow process during assembly, ensuring reliable solder joints and long-term durability.

Length: 12.8 mm

The length of 12.8 mm provides a balanced form factor that offers a good compromise between compactness and functionality, making this product suitable for various applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy surface mounting and soldering, ensuring secure connections and reliable performance in electronic circuits.

Nominal Supply Voltage: 14 V

The nominal supply voltage of 14 V provides a stable operating range for the peripheral driver, ensuring consistent performance and compatibility with common power sources.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27 mm allows for precise and compact arrangements of terminals, enhancing the overall design efficiency and functionality of the product.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this peripheral driver is less prone to moisture-related damage during storage and handling, improving its reliability and longevity.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge based interface IC type offers efficient control and management of peripheral devices, providing reliable performance and enhanced functionality in various applications.

Output Current Flow Direction: SOURCE AND SINK

The source and sink output current flow direction capability allows for versatile and flexible use of this peripheral driver in different circuit configurations, offering more options for system integration.

Technical Specifications

Peripheral Drivers TLE6282G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

7.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.6 mm

Trade Compliance

TLE6282G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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