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TLE6230GPAUMA1

Infineon Technologies

TLE6230GPAUMA1 by Infineon Technologies

TLE6230GPAUMA1 by Infineon is a 36-terminal peripheral driver with built-in protections for transient, over current, and over voltage. It operates at a supply voltage range of 4.5V to 5.5V and has a nominal output peak current limit of 1.5A. Ideal for applications requiring source and sink output current flow direction in compact designs with small outline package style.

Median Price

$3.727

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$3.727

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86

$3.727

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Chip Stock

USA . 4,600 parts In-Stock

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4,600

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Vyrian

USA . 2,247 parts In-Stock

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2,247

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Digiode

USA . 950 parts In-Stock

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950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,432 parts In-Stock

1+ parts

$2.638

100+ parts

$2.401

1k+ parts

$2.163

10k+ parts

-

3,432

$2.638

$2.401

$2.163

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Argo Parts USA

USA . 4,097 parts In-Stock

1+ parts

$3.148

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4,097

$3.148

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Continental Prestige Electronics

USA . 1,533 parts In-Stock

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$3.148

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10k+ parts

$3.086

1,533

$3.148

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-

$3.086

Ampacity Inc.

Singapore . 297 parts In-Stock

1+ parts

$6.500

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297

$6.500

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Aztec Data Supply Inc.

USA . 1,079 parts In-Stock

1+ parts

$6.900

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1,079

$6.900

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Modulus Dynamics

Lithuania . 835 parts In-Stock

1+ parts

$10.867

100+ parts

$10.432

1k+ parts

$9.998

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835

$10.867

$10.432

$9.998

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Corohmni

South Africa . 205 parts In-Stock

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$12.972

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205

$12.972

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$14.518

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576

$14.518

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Component Stockers USA

USA . 632 parts In-Stock

1+ parts

$99.990

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632

$99.990

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Perfect Parts

USA . 6,404 parts In-Stock

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6,404

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Corphita

USA . 803 parts In-Stock

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803

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Futuretech Components

Singapore . 800 parts In-Stock

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800

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RC Electronics

USA . 537 parts In-Stock

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100+ parts

$3.800

1k+ parts

$3.470

10k+ parts

$3.370

537

-

$3.800

$3.470

$3.370

Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 469 parts In-Stock

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469

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Overview

Unlock the power of seamless integration with the TLE6230GPAUMA1 Peripheral Driver by Infineon Technologies. Designed with quality and precision in mind, this versatile component offers robust built-in protections against transient events, over current, over voltage, and thermal issues. Ideal for a wide range of applications, from automotive to industrial systems, this innovative product guarantees reliability and efficiency. Trust Infineon Technologies to deliver unparalleled value and performance for all your electronic needs. Elevate your projects with the TLE6230GPAUMA1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, ideal for portable applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this peripheral driver is compatible with a wide range of systems and applications.

Package Shape: RECTANGULAR

The rectangular shape of the package offers ease of handling and installation, ensuring a secure fit on the PCB.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and longevity of the connected components by safeguarding against various electrical faults.

No. of Terminals: 36

The high number of terminals provides flexibility and compatibility with a range of configurations, offering versatile connectivity options.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline and heat sink/slug design, with shrink pitch, helps in efficient heat dissipation, ensuring optimal performance under high loads.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement makes this peripheral driver energy-efficient and suitable for low-power applications.

Terminal Finish: TIN

The terminal finish with tin coating ensures reliable electrical connections and corrosion resistance for long-term use.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved connectivity options, enhancing the reliability of the peripheral driver.

Maximum Seated Height: 3.5 mm

The low maximum seated height allows for a compact and space-saving design, ideal for applications with height restrictions.

Width: 11 mm

The modest width of the peripheral driver facilitates easy integration into tight spaces while providing sufficient surface area for secure mounting.

Length: 15.9 mm

The length of 15.9 mm strikes a balance between compactness and functionality, suitable for various PCB layouts.

Terminal Form: GULL WING

The gull-wing terminal form offers mechanical strength and ease of soldering, ensuring a secure and durable connection on the PCB.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard value widely used in electronic systems, ensuring broad compatibility with different setups.

Turn-on Time: 12 us

The fast turn-on time of 12 microseconds ensures quick response and minimal delay, suitable for time-critical applications.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, optimizing PCB real estate and enabling compact device designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the moisture resistance of the peripheral driver, ensuring reliability in humid environments.

Nominal Output Peak Current Limit: 1.5 A

The high nominal output peak current limit of 1.5 A enables the driver to handle demanding loads and peak currents efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides versatility in signal processing, making it suitable for a wide range of peripheral driver applications.

Turn-off Time: 10 us

The quick turn-off time of 10 microseconds ensures rapid response and efficient operation, crucial for dynamic systems.

Output Current Flow Direction: SOURCE AND SINK

The bidirectional output current flow direction allows the peripheral driver to both source and sink current, making it versatile for various signal processing tasks.

Technical Specifications

Peripheral Drivers TLE6230GPAUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

12 us

Width:

11 mm

Trade Compliance

TLE6230GPAUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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