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TLE6240GP

Infineon Technologies

TLE6240GP by Infineon Technologies

TLE6240GP by Infineon Technologies is a peripheral driver with a max supply voltage of 5.5V and built-in protections for transient, over current, over voltage, and thermal issues. It is commonly used as a buffer or inverter based peripheral driver in various applications.

Median Price

$10.000

Lifecycle Status

EOL

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Innovative Industries

USA . 14 parts In-Stock

1+ parts

$10.000

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14

$10.000

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Maritex

Poland . 2,992 parts In-Stock

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$69.504

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2,992

$69.504

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J2 Sourcing AB

Sweden . 4,495 parts In-Stock

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4,495

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Chip Stock

USA . 2,000 parts In-Stock

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2,000

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Rutronik

Germany . 800 parts In-Stock

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$8.540

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800

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$8.540

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ComSIT USA

USA . 665 parts In-Stock

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665

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Vyrian

USA . 380 parts In-Stock

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380

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Digiode

USA . 253 parts In-Stock

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253

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Bristol Electronics

USA . 65 parts In-Stock

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65

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Nova Conductors

Japan . 50 parts In-Stock

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50

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ComSIT Distribution GmbH

Germany . 14 parts In-Stock

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14

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,847 parts In-Stock

1+ parts

$2.444

100+ parts

$2.346

1k+ parts

$2.248

10k+ parts

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3,847

$2.444

$2.346

$2.248

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Ampacity Inc.

Singapore . 771 parts In-Stock

1+ parts

$12.500

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771

$12.500

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AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$17.480

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380

$17.480

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Semicontronic

India . 777 parts In-Stock

1+ parts

$20.500

100+ parts

$19.988

1k+ parts

$19.885

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777

$20.500

$19.988

$19.885

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Lixinc

USA . 9,396 parts In-Stock

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Continental Prestige Electronics

USA . 3,321 parts In-Stock

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Argo Parts USA

USA . 3,291 parts In-Stock

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GreenTree Electronics

Israel . 3,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,155 parts In-Stock

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1,155

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Kepictronics

USA . 617 parts In-Stock

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617

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Corphita

USA . 389 parts In-Stock

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389

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Speed Components Ltd (Excess)

Israel . 15 parts In-Stock

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15

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience the exceptional quality and reliability of the TLE6240GP by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures that their products are crafted with precision and care. The TLE6240GP belongs to the category of Peripheral Drivers, making it an essential component in various applications. What sets this product apart is its outstanding value and benefits it offers to customers. With built-in protections against transients, over current, over voltage, and thermal issues, you can trust that your system will remain safe and secure. Its compact size, high maximum supply voltage, and quick turn-on/off time make it ideal for a wide range of projects. Unlock the potential of your designs with the TLE6240GP and experience the advantages it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material being made of plastic/epoxy ensures durability and lightweight construction, making it suitable for portable applications.

Surface Mount: YES

With surface mount capability, this product allows for easy and efficient installation, saving valuable space on circuit boards.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V ensures compatibility with a wide range of systems, offering versatility and flexibility in design.

No. of Functions: 2

Featuring two functions, this peripheral driver provides multiple capabilities in a single product, simplifying the circuit design process and reducing component count.

Screening Level: AEC-Q100

Compliant with the AEC-Q100 screening level, this product guarantees high reliability and performance, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape enhances compatibility with commonly used board designs, facilitating integration into various electronic systems.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE, THERMAL

Equipped with built-in protections against transient events, over current, over voltage, and thermal issues, this peripheral driver ensures safe and reliable operation.

Power Supplies (V): 5

Operating with a power supply voltage of 5 V, this product offers compatibility with standard power sources, simplifying system integration.

No. of Terminals: 36

With a high number of terminals, this peripheral driver supports complex connectivity requirements, allowing for versatile and flexible system designs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package style with a heat sink/slug and shrink pitch construction allows for efficient heat dissipation and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage requirement of 4.5 V ensures reliable operation even in low voltage conditions, increasing overall system robustness.

Terminal Finish: TIN

With a tin terminal finish, this product offers excellent electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout options, optimizing signal routing and minimizing signal interference for improved system performance.

Maximum Seated Height: 3.5 mm

With a maximum seated height of 3.5 mm, this peripheral driver enables compact designs and improves airflow within electronic systems, minimizing the risk of overheating.

Width: 11 mm

The compact width of 11 mm ensures easy integration into space-limited applications, allowing for efficient board utilization.

Length: 15.9 mm

With a length of 15.9 mm, this peripheral driver offers a balanced form factor, facilitating compatibility with various circuit board designs.

Technology: MOS

Utilizing MOS (Metal-Oxide-Semiconductor) technology, this product delivers high-speed performance, low power consumption, and excellent noise immunity, making it an optimal choice for demanding applications.

Terminal Form: GULL WING

Featuring a gull-wing terminal form, this peripheral driver simplifies the soldering process, ensuring secure connections and reliable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying system design and integration.

Turn-on Time: 12 us

With a quick turn-on time of 12 microseconds, this peripheral driver enables fast response and minimizes delays in signal transmission, improving overall system efficiency.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density board designs, maximizing functionality in a limited space.

Moisture Sensitivity Level (MSL): 3

Compliant with MSL level 3, this product offers increased resistance to moisture, ensuring durability and long-term reliability in various environments.

Nominal Output Peak Current Limit: 4.5 A

The nominal output peak current limit of 4.5 A allows for high current drive capability, making this peripheral driver suitable for power-hungry applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This peripheral driver serves as a buffer or inverter based interface IC, providing versatile and flexible signal processing options for different system requirements.

Turn-off Time: 12 us

With a turn-off time of 12 microseconds, this product ensures fast and efficient signal control, contributing to improved system performance.

Output Current Flow Direction: SINK

Configured for output current flow direction as a sink, this peripheral driver effectively regulates and controls the flow of current, ensuring reliable operation and protecting connected devices.

Technical Specifications

Peripheral Drivers TLE6240GP attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

3.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

12 us

Turn-on Time:

12 us

Width:

11 mm

Trade Compliance

TLE6240GP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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