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TLE6220GPXT

Infineon Technologies

TLE6220GPXT by Infineon Technologies

TLE6220GPXT by Infineon Technologies is a 20-terminal peripheral driver with built-in protections for transient, over current, and over voltage. It operates at a supply voltage range of 4.5V to 5.5V and has a nominal output peak current limit of 4.5A. This small outline IC is ideal for applications requiring buffer or inverter based peripheral drivers with sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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300

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Vyrian

USA . 250 parts In-Stock

1+ parts

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250

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Digiode

USA . 210 parts In-Stock

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,511 parts In-Stock

1+ parts

$2.682

100+ parts

$2.575

1k+ parts

$2.467

10k+ parts

-

4,511

$2.682

$2.575

$2.467

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Corohmni

South Africa . 318 parts In-Stock

1+ parts

$3.923

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318

$3.923

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Aztec Data Supply Inc.

USA . 2,615 parts In-Stock

1+ parts

$6.230

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2,615

$6.230

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$7.240

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738

$7.240

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Ampacity Inc.

Singapore . 672 parts In-Stock

1+ parts

$37.500

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672

$37.500

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Semicontronic

India . 760 parts In-Stock

1+ parts

$48.500

100+ parts

$47.288

1k+ parts

$47.045

10k+ parts

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760

$48.500

$47.288

$47.045

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Argo Parts USA

USA . 3,147 parts In-Stock

1+ parts

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3,147

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Continental Prestige Electronics

USA . 2,385 parts In-Stock

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2,385

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 714 parts In-Stock

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714

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Advanced Electronics

New Zealand . 56 parts In-Stock

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56

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Overview

Upgrade your electronic projects with the TLE6220GPXT from Infineon Technologies, a leading manufacturer known for top-quality components. This peripheral driver offers built-in protections against transient events, overcurrent, overvoltage, and thermal issues, ensuring reliable performance. With a compact package design and easy surface mounting, this versatile device is perfect for a wide range of applications. Experience the value and benefits of Infineon's TLE6220GPXT for yourself and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for long-term use.

Surface Mount: YES

The surface mount design makes it easy to install and saves valuable space on a PCB.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power sources, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety of the connected components and extends the lifespan of the peripheral driver.

No. of Terminals: 20

With a high number of terminals, this peripheral driver can support complex circuit configurations and connections.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with heat sink/slug allows for efficient heat dissipation, ensuring optimal performance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options.

Maximum Seated Height: 3.5 mm

The low maximum seated height allows for a compact design, ideal for space-constrained applications.

Width: 11 mm

The moderate width of the peripheral driver makes it suitable for various PCB layouts.

Length: 15.9 mm

The length of the peripheral driver is designed for easy integration into different circuit configurations.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, minimizing the risk of signal loss or interruptions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Turn-on Time: 10 us

With a fast turn-on time of 10 microseconds, this peripheral driver can quickly respond to input signals, ideal for time-sensitive applications.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density PCB layouts, saving space and reducing manufacturing costs.

Nominal Output Peak Current Limit: 4.5 A

The high nominal output peak current limit of 4.5A allows for robust performance in demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type provides compatibility with a wide range of devices, increasing the product's flexibility.

Turn-off Time: 10 us

The quick turn-off time of 10 microseconds ensures efficient operation and reduces the risk of signal interference.

Output Current Flow Direction: SINK

The sink output current flow direction is suitable for driving external components, making it a versatile choice for various applications.

Technical Specifications

Peripheral Drivers TLE6220GPXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

20

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

11 mm

Trade Compliance

TLE6220GPXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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