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TLE6225G

Infineon Technologies

TLE6225G by Infineon Technologies

TLE6225G by Infineon Technologies is a peripheral driver with 4 functions, MOS technology, and built-in protections for transient, over current, over voltage, and thermal issues. It operates at supply voltages ranging from 4.5V to 32V and has a max output current of 0.3A. This small outline package driver is ideal for applications requiring buffer or inverter based peripheral drivers with sink output current flow direction.

Median Price

$2.730

Lifecycle Status

EOL

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10,114 parts In-Stock

1+ parts

$3.660

100+ parts

-

1k+ parts

$1.800

10k+ parts

$1.770

10,114

$3.660

-

$1.800

$1.770

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

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$1.800

10k+ parts

$1.636

1,000

-

-

$1.800

$1.636

Distributors (In-Stock)

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Vyrian

USA . 468 parts In-Stock

1+ parts

$2.000

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468

$2.000

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Freelance Electronics

USA . 865 parts In-Stock

1+ parts

$2.704

100+ parts

$2.839

1k+ parts

$2.677

10k+ parts

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865

$2.704

$2.839

$2.677

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Digiode

USA . 520 parts In-Stock

1+ parts

$3.477

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520

$3.477

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Rutronik

Germany . 9,000 parts In-Stock

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$1.740

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9,000

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$1.740

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LIBRA Elektronik GmbH

Germany . 7,999 parts In-Stock

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7,999

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Bristol Electronics

USA . 1,933 parts In-Stock

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Atlantic Semiconductor

USA . 1,539 parts In-Stock

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1,539

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GES GmbH

Germany . 1,347 parts In-Stock

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Sternenhof Electronics

Switzerland . 750 parts In-Stock

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750

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PC Components Company LLC

USA . 718 parts In-Stock

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718

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NexGen Digital

USA . 699 parts In-Stock

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699

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Inventory MP

USA . 394 parts In-Stock

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394

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Fibra_Brandt Electronic GMBH

Germany . 270 parts In-Stock

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270

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Rebound Electronics

UK . 170 parts In-Stock

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170

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Cyclops Electronics Ltd

UK . 161 parts In-Stock

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161

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A2Z Electronics, Inc.

USA . 90 parts In-Stock

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90

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,896 parts In-Stock

1+ parts

$3.110

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9,896

$3.110

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Corphita

USA . 233 parts In-Stock

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$3.294

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233

$3.294

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Modulus Dynamics

Lithuania . 3,462 parts In-Stock

1+ parts

$6.467

100+ parts

$6.208

1k+ parts

$5.950

10k+ parts

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3,462

$6.467

$6.208

$5.950

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Kepictronics

USA . 43,590 parts In-Stock

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43,590

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Perfect Parts

USA . 43,039 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 10,175 parts In-Stock

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Assy Fe

Spain . 5,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,628 parts In-Stock

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1,628

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ChipstoGo Electronic ltd

UK . 163 parts In-Stock

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163

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Overview

Unleash the power of innovation with the TLE6225G by Infineon Technologies. As a leader in manufacturing excellence, Infineon Technologies brings you a high-quality peripheral driver that is designed to exceed your expectations. Ideal for a wide range of applications, this product offers customers unrivaled value, benefits, and advantages. Experience seamless performance, reliability, and efficiency like never before with the TLE6225G. Elevate your projects to new heights with this cutting-edge solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, providing flexibility in various electronic systems.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding against transient events, overloads, voltage spikes, and excessive heat.

Nominal Output Peak Current Limit: 0.75 A

The nominal output peak current limit of 0.75 A allows the peripheral driver to handle high current loads effectively, making it suitable for driving various peripherals in electronics.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter-based peripheral driver offers flexibility in interfacing with different types of electronic devices, making it versatile and compatible with various systems.

Technical Specifications

Peripheral Drivers TLE6225G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/32

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

7.6 mm

Trade Compliance

TLE6225G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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