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FPF2701MPX

Onsemi

FPF2701MPX by Onsemi

FPF2701MPX by Onsemi is a peripheral driver with a max supply voltage of 36V and built-in protections for over current, thermal, and under voltage. It has 8 terminals in a small outline package style suitable for industrial applications requiring a nominal output peak current limit of 0.4A.

Median Price

$1.730

Lifecycle Status

EOL

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 145,800 parts In-Stock

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145,800

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.730

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50

$1.730

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Chip Stock

USA . 7,794 parts In-Stock

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7,794

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Vyrian

USA . 3,861 parts In-Stock

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3,861

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Atlantic Semiconductor

USA . 1,545 parts In-Stock

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1,545

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Component Sense

UK . 1,500 parts In-Stock

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1,500

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Flip Electronics

USA . 1,233 parts In-Stock

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Digiode

USA . 637 parts In-Stock

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637

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Bristol Electronics

USA . 108 parts In-Stock

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108

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Prism Electronics

USA . 19 parts In-Stock

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19

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EPE Components Inc.

USA . 8 parts In-Stock

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8

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North Shore Components

USA . 7 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,190 parts In-Stock

1+ parts

$1.705

100+ parts

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$1.671

4,190

$1.705

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$1.671

Argo Parts USA

USA . 602 parts In-Stock

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$1.705

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602

$1.705

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Netroflash

USA . 50 parts In-Stock

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$1.730

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50

$1.730

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Aztec Data Supply Inc.

USA . 2,298 parts In-Stock

1+ parts

$3.552

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2,298

$3.552

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Component Stockers USA

USA . 4,254 parts In-Stock

1+ parts

$3.820

100+ parts

$2.700

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$2.700

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4,254

$3.820

$2.700

$2.700

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Semicontronic

India . 145,674 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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145,674

$4.500

$4.388

$4.365

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Advanced Electronics

New Zealand . 1,771 parts In-Stock

1+ parts

$5.385

100+ parts

$5.116

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$5.116

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1,771

$5.385

$5.116

$5.116

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Modulus Dynamics

Lithuania . 4,186 parts In-Stock

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$6.289

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$6.289

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$6.289

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4,186

$6.289

$6.289

$6.289

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Microchip USA

USA . 100 parts In-Stock

1+ parts

$17.360

100+ parts

$17.250

1k+ parts

$17.190

10k+ parts

$17.140

100

$17.360

$17.250

$17.190

$17.140

Ampacity Inc.

Singapore . 145,679 parts In-Stock

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$42.500

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145,679

$42.500

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,668 parts In-Stock

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Perfect Parts

USA . 10,338 parts In-Stock

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Kulean Microsystems

USA . 8,317 parts In-Stock

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TANS Electronics

Latvia . 8,159 parts In-Stock

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Problanco Electronics

Mexico . 8,017 parts In-Stock

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SupplyDigital Components

Austria . 6,280 parts In-Stock

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Lixinc

USA . 4,718 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,800 parts In-Stock

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2,800

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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2,400

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Robosynatics

Brazil . 1,702 parts In-Stock

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$2.702

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$2.647

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$2.647

1,702

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$2.702

$2.647

$2.647

Lucentia Tech

USA . 1,702 parts In-Stock

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$2.702

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$2.647

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$2.647

1,702

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$2.702

$2.647

$2.647

Corphita

USA . 1,661 parts In-Stock

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Supply Digital

USA . 1,650 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 488 parts In-Stock

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488

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Corohmni

South Africa . 448 parts In-Stock

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448

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Overview

Elevate your electronics with the FPF2701MPX by Onsemi, a top-tier manufacturer known for quality and innovation. As a leading peripheral driver in the industry, this product offers unparalleled performance and reliability. From overcurrent protection to thermal management, the FPF2701MPX ensures your devices are safe and efficient. Whether you're working on automotive applications or consumer electronics, this product provides the value, benefits, and advantages you need to take your projects to the next level. Trust Onsemi to deliver excellence every time with the FPF2701MPX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and provides protection to the internal components.

Surface Mount: YES

The ability to be surface mounted makes installation easier and more efficient.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

Package Shape: SQUARE

The square package shape allows for a compact design that can fit easily into different systems.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of the peripheral driver and connected devices.

Power Supplies (V): 2.8/36

This wide range of power supply options allows for flexibility in different applications.

No. of Terminals: 8

The eight terminals provide multiple connection points for various devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design allow for efficient heat dissipation and space-saving installation.

Minimum Supply Voltage: 2.8 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The terminal finish provides corrosion resistance and ensures long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections in different orientations.

Maximum Seated Height: 0.8 mm

The low maximum seated height minimizes space requirements in tight installations.

Width: 3 mm

The compact width enables the peripheral driver to fit into narrow spaces.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures a strong and reliable solder joint.

Length: 3 mm

The short length makes this peripheral driver suitable for compact devices or installations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and allows for lead-free soldering.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12V is ideal for a wide range of applications.

Terminal Pitch: 0.65 mm

The small terminal pitch provides high-density mounting capabilities for space-saving designs.

Nominal Output Peak Current Limit: 0.4 A

The nominal output peak current limit ensures safe operation within specified limits.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type offers versatile compatibility with different systems.

Output Current Flow Direction: SOURCE

The output current flow direction being source allows for efficient control and power distribution.

Technical Specifications

Peripheral Drivers FPF2701MPX attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Nominal Output Peak Current Limit:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8/36

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

FPF2701MPX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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