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PTPS272C45ARHFR

Texas Instruments

PTPS272C45ARHFR by Texas Instruments

PTPS272C45ARHFR by Texas Instruments is a peripheral driver with 2 functions, operating voltage range of 6-36V, and built-in protections. It is used in automotive applications due to its high side driver feature and standard input characteristics. The chip carrier package style with very thin profile makes it suitable for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,770 parts In-Stock

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Digiode

USA . 2,478 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 1,164 parts In-Stock

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$3.137

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$3.657

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$3.137

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$3.657

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DigiPath Technology Company

USA . 1,026 parts In-Stock

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$3.454

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$3.178

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$3.454

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ChromeModa Solutions

Germany . 6,616 parts In-Stock

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$3.525

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$2.890

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$2.890

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IDEA Electronic Components Group

UK . 1,858 parts In-Stock

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$3.525

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$3.172

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$3.525

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$3.172

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AZTECH Wire

Italy . 605 parts In-Stock

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$5.411

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605

$5.411

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Corohmni

South Africa . 407 parts In-Stock

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$7.576

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One Stop Electronics

USA . 1,341 parts In-Stock

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$20.500

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Ampacity Inc.

Singapore . 429 parts In-Stock

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$39.500

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Semicontronic

India . 226 parts In-Stock

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$39.500

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$38.512

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$38.315

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226

$39.500

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$38.315

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Argo Parts USA

USA . 3,518 parts In-Stock

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Corphita

USA . 1,265 parts In-Stock

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Continental Prestige Electronics

USA . 1,199 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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$0.225

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$0.225

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$0.225

950

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$0.225

$0.225

$0.225

Advanced Electronics

New Zealand . 300 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Get ready to experience top-notch performance with the PTPS272C45ARHFR by Texas Instruments. As a leader in semiconductor technology, Texas Instruments ensures unparalleled quality and reliability in their products. This chip carrier, heat sink profile offers built-in protections against transient events, over current, over voltage, thermal issues, and more. Ideal for automotive applications, this peripheral driver provides 2 channels of high side drivers with a nominal output peak current limit of 5.8A. Say goodbye to worries about voltage fluctuations and let Texas Instruments deliver the efficiency and precision you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs which saves space and simplifies assembly.

Maximum Supply Voltage: 36 V

Can handle a high supply voltage which provides flexibility in various implementation scenarios.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the connected components by safeguarding against various fault conditions.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive applications where heat dissipation is crucial.

No. of Functions: 2

Offers multiple functionalities in a single device, saving space and reducing the need for additional components.

Technical Specifications

Peripheral Drivers PTPS272C45ARHFR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Additional Features:

IT ALSO NEED 3 TO 5.5 V SUPPLY

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

High Side Driver:

YES

Input Characteristics:

STANDARD

JESD-30 Code:

R-PQCC-N24

Length:

5 mm

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Turn-off Time:

70 us

Turn-on Time:

70 us

Width:

4 mm

Trade Compliance

PTPS272C45ARHFR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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