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PTPS2HB16AQPWPRQ1

Texas Instruments

PTPS2HB16AQPWPRQ1 by Texas Instruments

PTPS2HB16AQPWPRQ1 by Texas Instruments is a Peripheral Driver with 2 functions, operating at -40 to 125 °C. It offers built-in protections for transient, over current, thermal, and under voltage scenarios. Ideal for automotive applications due to AEC-Q100 screening level and sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,878 parts In-Stock

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Digiode

USA . 326 parts In-Stock

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326

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 414 parts In-Stock

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$7.220

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$7.220

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Parana Technologies

USA . 127 parts In-Stock

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$7.441

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$7.928

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127

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$7.928

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Corohmni

South Africa . 887 parts In-Stock

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$7.481

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DigiPath Technology Company

USA . 299 parts In-Stock

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$8.194

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

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$8.361

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$6.856

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IDEA Electronic Components Group

UK . 634 parts In-Stock

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$8.361

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$7.943

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$7.525

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Ampacity Inc.

Singapore . 1,586 parts In-Stock

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$10.500

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One Stop Electronics

USA . 343 parts In-Stock

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$48.500

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Corphita

USA . 4,934 parts In-Stock

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Continental Prestige Electronics

USA . 2,699 parts In-Stock

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Argo Parts USA

USA . 1,678 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the unparalleled quality of Texas Instruments with the PTPS2HB16AQPWPRQ1, a cutting-edge Peripheral Driver designed for automotive applications. With built-in protections for transient events, over current situations, thermal issues, and under voltage conditions, this product ensures reliable and safe operation. Its small outline package with 16 terminals makes it easy to integrate into your systems, while its high output peak current limit of 29.1 A provides exceptional performance. Trust Texas Instruments to deliver superior solutions for your automotive needs with the PTPS2HB16AQPWPRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Being surface mountable makes the installation of this peripheral driver convenient and suitable for compact electronic designs.

Maximum Supply Voltage: 18 V

With a maximum supply voltage of 18V, this peripheral driver can handle higher voltage inputs for versatile applications.

No. of Functions: 2

Having two functions integrated into one device allows for more efficient use of space and simplifies the overall design of the system.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the peripheral driver by safeguarding it against various potential risks.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this peripheral driver can perform reliably in high temperature environments.

Nominal Output Peak Current Limit: 29.1 A

The high nominal output peak current limit of 29.1A allows this peripheral driver to drive demanding loads with ease.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver enables compatibility with a wide range of electronic devices and systems.

Technical Specifications

Peripheral Drivers PTPS2HB16AQPWPRQ1 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G16

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

29.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Turn-off Time:

147 us

Turn-on Time:

145 us

Trade Compliance

PTPS2HB16AQPWPRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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