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BSP75NXT

Infineon Technologies

BSP75NXT by Infineon Technologies

BSP75NXT by Infineon Technologies is a small outline peripheral driver with built-in protections for transient, over current, and over voltage. It operates at 12V nominal voltage with a 0.7A output peak current limit. Ideal for applications requiring sink output current flow direction and fast turn-on/off times of 20us.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 24,000 parts In-Stock

1+ parts

-

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-

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-

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$0.664

24,000

-

-

-

$0.664

Mouser Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.676

4,000

-

-

-

$0.676

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.865

100+ parts

-

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700

$0.865

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Vyrian

USA . 13,839 parts In-Stock

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13,839

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Digiode

USA . 763 parts In-Stock

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763

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VNN

France . 184 parts In-Stock

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184

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 13,957 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

1k+ parts

$0.543

10k+ parts

-

13,957

$0.560

$0.546

$0.543

-

Ampacity Inc.

Singapore . 13,853 parts In-Stock

1+ parts

$0.560

100+ parts

-

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13,853

$0.560

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Argo Parts USA

USA . 201 parts In-Stock

1+ parts

$0.865

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201

$0.865

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Corohmni

South Africa . 161 parts In-Stock

1+ parts

$9.162

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161

$9.162

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Modulus Dynamics

Lithuania . 3,776 parts In-Stock

1+ parts

$10.010

100+ parts

$9.610

1k+ parts

$9.209

10k+ parts

-

3,776

$10.010

$9.610

$9.209

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Aztec Data Supply Inc.

USA . 4,425 parts In-Stock

1+ parts

$10.540

100+ parts

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4,425

$10.540

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.789

100+ parts

$10.250

1k+ parts

$10.250

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100

$10.789

$10.250

$10.250

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Continental Prestige Electronics

USA . 1,200 parts In-Stock

1+ parts

$40.920

100+ parts

$28.643

1k+ parts

$28.643

10k+ parts

$28.643

1,200

$40.920

$28.643

$28.643

$28.643

Andel Nordic

Denmark . 448 parts In-Stock

1+ parts

$40.920

100+ parts

-

1k+ parts

$28.643

10k+ parts

$28.643

448

$40.920

-

$28.643

$28.643

Robosynatics

Brazil . 3,000 parts In-Stock

1+ parts

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3,000

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Lucentia Tech

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

$0.409

1k+ parts

$0.409

10k+ parts

$0.409

3,000

-

$0.409

$0.409

$0.409

Corphita

USA . 751 parts In-Stock

1+ parts

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751

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Overview

Discover the BSP75NXT by Infineon Technologies, a top-of-the-line peripheral driver that delivers unmatched quality and reliability. With built-in protections against transient, over current, over voltage, and thermal issues, this product offers peace of mind to customers in various applications. The compact design and matte tin terminal finish make it easy to integrate into any project, while the nominal supply voltage of 12V ensures optimal performance. Experience the superior value and benefits of the BSP75NXT, providing seamless operation and enhanced functionality for your electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into electronic circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Built-in protections ensure safety and reliability by guarding against various potential issues.

Nominal Supply Voltage: 12 V

Suitable for applications requiring a supply voltage of 12V, providing compatibility with a wide range of devices.

Nominal Output Peak Current Limit: 0.7 A

High output peak current limit of 0.7A allows for driving peripherals with higher power requirements.

Technical Specifications

Peripheral Drivers BSP75NXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

20 us

Turn-on Time:

20 us

Width:

3.5 mm

Trade Compliance

BSP75NXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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