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BTS640S2GATMA1

Infineon Technologies

BTS640S2GATMA1 by Infineon Technologies

BTS640S2GATMA1 by Infineon is a MOS technology peripheral driver with 6 terminals. It offers built-in protections for over current, over voltage, thermal, and under voltage. With a max supply voltage of 34V and nominal output peak current limit of 19A, it's ideal for applications requiring buffer or inverter based peripheral drivers.

Median Price

$4.849

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49,464 parts In-Stock

1+ parts

$1.808

100+ parts

-

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49,464

$1.808

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.910

10k+ parts

-

1,000

$2.010

$1.960

$1.910

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Farnell

UK . 7,634 parts In-Stock

1+ parts

$4.849

100+ parts

$3.423

1k+ parts

$2.593

10k+ parts

-

7,634

$4.849

$3.423

$2.593

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Mouser Electronics

USA . 3,318 parts In-Stock

1+ parts

$4.930

100+ parts

$3.140

1k+ parts

$2.850

10k+ parts

$2.790

3,318

$4.930

$3.140

$2.850

$2.790

Newark

USA . 8,147 parts In-Stock

1+ parts

$5.140

100+ parts

$3.280

1k+ parts

$3.070

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-

8,147

$5.140

$3.280

$3.070

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DigiKey

USA . 4,132 parts In-Stock

1+ parts

$5.960

100+ parts

$3.792

1k+ parts

$3.494

10k+ parts

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4,132

$5.960

$3.792

$3.494

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Element14

Singapore . 7,610 parts In-Stock

1+ parts

$7.620

100+ parts

$5.610

1k+ parts

$4.040

10k+ parts

-

7,610

$7.620

$5.610

$4.040

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Verical

USA . 49,464 parts In-Stock

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49,464

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EBV Elektronik

Germany . 18,000 parts In-Stock

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RS (Exports)

UK . 1,000 parts In-Stock

1+ parts

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$2.580

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1,000

-

-

$2.580

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Rochester

USA . 910 parts In-Stock

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100+ parts

$2.520

1k+ parts

$2.250

10k+ parts

$2.120

910

-

$2.520

$2.250

$2.120

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 592 parts In-Stock

1+ parts

$1.910

100+ parts

-

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592

$1.910

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Ozdisan Elektronik

Türkiye . 75 parts In-Stock

1+ parts

$2.692

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75

$2.692

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Nova Conductors

Japan . 20 parts In-Stock

1+ parts

$3.600

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20

$3.600

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TME

Poland . 422 parts In-Stock

1+ parts

$4.140

100+ parts

$3.060

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422

$4.140

$3.060

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Chip Stock

USA . 17,500 parts In-Stock

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17,500

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NAC Semi

USA . 14,000 parts In-Stock

1+ parts

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$5.070

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14,000

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-

$5.070

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Flip Electronics

USA . 11,000 parts In-Stock

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Rutronik

Germany . 8,000 parts In-Stock

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$2.460

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8,000

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$2.460

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Vyrian

USA . 3,366 parts In-Stock

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3,366

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IBS Electronics

USA . 1,000 parts In-Stock

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$3.571

10k+ parts

$3.063

1,000

-

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$3.571

$3.063

VNN

France . 909 parts In-Stock

1+ parts

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Huijzer Components

Netherlands . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,009 parts In-Stock

1+ parts

$1.610

100+ parts

$1.570

1k+ parts

$1.562

10k+ parts

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3,009

$1.610

$1.570

$1.562

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Corphita

USA . 896 parts In-Stock

1+ parts

$1.809

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896

$1.809

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Ampacity Inc.

Singapore . 3,134 parts In-Stock

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$3.500

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Argo Parts USA

USA . 1,929 parts In-Stock

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$3.600

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Netroflash

USA . 1,000 parts In-Stock

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$3.600

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$3.600

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Continental Prestige Electronics

USA . 4,863 parts In-Stock

1+ parts

$4.740

100+ parts

$2.990

1k+ parts

$2.260

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4,863

$4.740

$2.990

$2.260

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Aztec Data Supply Inc.

USA . 4,036 parts In-Stock

1+ parts

$8.387

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4,036

$8.387

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Corohmni

South Africa . 1,018 parts In-Stock

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$9.069

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$9.069

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Modulus Dynamics

Lithuania . 3,613 parts In-Stock

1+ parts

$14.509

100+ parts

$13.929

1k+ parts

$13.348

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3,613

$14.509

$13.929

$13.348

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Microchip USA

USA . 2,831 parts In-Stock

1+ parts

$17.120

100+ parts

$17.010

1k+ parts

$16.960

10k+ parts

$16.900

2,831

$17.120

$17.010

$16.960

$16.900

RC Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$3.500

1k+ parts

$3.190

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$3.100

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$3.500

$3.190

$3.100

GreenTree Electronics

Israel . 9,000 parts In-Stock

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Perfect Parts

USA . 7,840 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Glotronic Ltd.

UK . 800 parts In-Stock

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800

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Infinite Electronics LLP (Excess)

. 452 parts In-Stock

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452

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Advanced Electronics

New Zealand . 85 parts In-Stock

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85

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Overview

Upgrade your devices with the BTS640S2GATMA1 from Infineon Technologies, a leading manufacturer known for top-quality products. This peripheral driver offers built-in protections against over current, over voltage, thermal issues, and under voltage, ensuring the safety and longevity of your applications. With a nominal output peak current limit of 19 A and a fast turn-on time of 150 us, this product provides reliable performance. Whether you're working on automotive, industrial, or consumer electronics projects, the BTS640S2GATMA1 delivers the value, benefits, and advantages you need for success. Trust in Infineon Technologies to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material makes the peripheral driver lightweight and durable, suitable for a variety of applications.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of connected devices by preventing damage from over current, over voltage, thermal issues, and under voltage conditions.

Nominal Output Peak Current Limit: 19 A

With a high nominal output peak current limit of 19 A, this peripheral driver can efficiently drive devices that require high current levels.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12 V ensures compatibility with a wide range of devices and power sources.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver provides flexibility in signal processing and control, enhancing the versatility of the product.

Technical Specifications

Peripheral Drivers BTS640S2GATMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

19 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Turn-off Time:

200 us

Turn-on Time:

150 us

Width:

9.25 mm

Trade Compliance

BTS640S2GATMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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