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FSFR2100XS

Onsemi

FSFR2100XS by Onsemi

FSFR2100XS by Onsemi is a half bridge peripheral driver with 9 terminals in a rectangular package. It offers over current, over voltage, thermal, and under voltage protection. Ideal for applications requiring source and sink output current flow control.

Median Price

$5.348

Lifecycle Status

EOL

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 729 parts In-Stock

1+ parts

$5.140

100+ parts

$3.960

1k+ parts

$2.850

10k+ parts

$2.730

729

$5.140

$3.960

$2.850

$2.730

Arrow

USA . 16 parts In-Stock

1+ parts

$5.555

100+ parts

$4.279

1k+ parts

$3.080

10k+ parts

$2.950

16

$5.555

$4.279

$3.080

$2.950

EBV Elektronik

Germany . 19 parts In-Stock

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19

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Verical

USA . 16 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$3.780

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-

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22

$3.780

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Digiode

USA . 2,006 parts In-Stock

1+ parts

$4.883

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2,006

$4.883

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Chip Stock

USA . 14,628 parts In-Stock

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14,628

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Flip Electronics

USA . 950 parts In-Stock

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950

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NAC Semi

USA . 342 parts In-Stock

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$3.530

1k+ parts

$3.270

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342

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$3.530

$3.270

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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300

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ComSIT Distribution GmbH

Germany . 247 parts In-Stock

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Vyrian

USA . 209 parts In-Stock

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Prism Electronics

USA . 64 parts In-Stock

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64

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Semicontronic

India . 175 parts In-Stock

1+ parts

$2.380

100+ parts

$2.320

1k+ parts

$2.309

10k+ parts

-

175

$2.380

$2.320

$2.309

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Argo Parts USA

USA . 1,739 parts In-Stock

1+ parts

$3.153

100+ parts

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1,739

$3.153

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Corohmni

South Africa . 213 parts In-Stock

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$3.530

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213

$3.530

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.780

100+ parts

$3.704

1k+ parts

-

10k+ parts

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1,000

$3.780

$3.704

-

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Corphita

USA . 989 parts In-Stock

1+ parts

$4.626

100+ parts

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989

$4.626

-

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Ampacity Inc.

Singapore . 143 parts In-Stock

1+ parts

$5.170

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143

$5.170

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Continental Prestige Electronics

USA . 454 parts In-Stock

1+ parts

$5.430

100+ parts

$3.100

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454

$5.430

$3.100

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Aztec Data Supply Inc.

USA . 2,890 parts In-Stock

1+ parts

$6.427

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2,890

$6.427

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Perfect Parts

USA . 341,012 parts In-Stock

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Lixinc

USA . 18,152 parts In-Stock

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S.R.D Solutions

India . 7,090 parts In-Stock

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Problanco Electronics

Mexico . 6,879 parts In-Stock

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6,879

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Futuretech Components

Singapore . 3,325 parts In-Stock

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3,325

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TANS Electronics

Latvia . 2,757 parts In-Stock

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2,757

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Kulean Microsystems

USA . 1,610 parts In-Stock

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Microchip USA

USA . 1,294 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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700

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Supply Digital

USA . 582 parts In-Stock

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582

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Kepictronics

USA . 475 parts In-Stock

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475

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UHIMA Technologies

Türkiye . 462 parts In-Stock

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462

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SupplyDigital Components

Austria . 413 parts In-Stock

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413

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Experience unparalleled performance with the FSFR2100XS by Onsemi, a top-of-the-line Peripheral Driver that guarantees superior quality and reliability. Designed with state-of-the-art built-in protections against over current, over voltage, thermal issues, and under voltage, this product ensures your devices are safeguarded at all times. With a sleek rectangular package body made of durable plastic/epoxy material, this peripheral driver boasts a flange mount package style with 9 terminals for easy installation. Perfect for a wide range of applications, this Half Bridge Based Peripheral Driver offers unmatched value and benefits, making it a must-have for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, ideal for use in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into different systems or circuits.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of the connected peripherals by preventing damage due to overcurrent, overvoltage, thermal issues, and undervoltage conditions.

No. of Terminals: 9

The 9 terminals provide flexibility in connecting the peripheral driver to different components or devices, allowing for versatile usage.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure and stable installation of the peripheral driver in a system, reducing the risk of disconnection or damage.

Terminal Finish: MATTE TIN

The matte tin finish offers good electrical conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: ZIG-ZAG

The zig-zag terminal position helps in easy identification and connection of the terminals, simplifying the installation process.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure soldering connections, ensuring stable and reliable electrical connections.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge based interface IC type provides efficient control and driving capabilities for connected peripherals, enhancing overall system performance.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current allows for bi-directional control of the connected peripherals, providing flexibility in operation and functionality.

Technical Specifications

Peripheral Drivers FSFR2100XS attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PZFM-T9

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

9

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

FSFR2100XS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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