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FSFR1800HS

Onsemi

FSFR1800HS by Onsemi

FSFR1800HS by Onsemi is a RECTANGULAR package peripheral driver with 9 terminals. It offers OVER CURRENT, OVER VOLTAGE, THERMAL, and UNDER VOLTAGE protection. Ideal for applications requiring HALF BRIDGE BASED PERIPHERAL DRIVER with SOURCE AND SINK output current flow direction.

Median Price

$2.450

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,253 parts In-Stock

1+ parts

$1.982

100+ parts

-

1k+ parts

-

10k+ parts

-

3,253

$1.982

-

-

-

Rochester

USA . 5,225 parts In-Stock

1+ parts

$2.450

100+ parts

$2.400

1k+ parts

$2.350

10k+ parts

-

5,225

$2.450

$2.400

$2.350

-

DigiKey

USA . 331 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

$1.940

10k+ parts

$1.636

331

$3.100

-

$1.940

$1.636

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,137 parts In-Stock

1+ parts

$1.883

100+ parts

-

1k+ parts

-

10k+ parts

-

1,137

$1.883

-

-

-

Vyrian

USA . 2,325 parts In-Stock

1+ parts

$1.982

100+ parts

-

1k+ parts

-

10k+ parts

-

2,325

$1.982

-

-

-

Bristol Electronics

USA . 293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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293

-

-

-

-

Dan-Mar Components

USA . 293 parts In-Stock

1+ parts

-

100+ parts

-

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293

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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68

-

-

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Nova Conductors

Japan . 19 parts In-Stock

1+ parts

-

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,589 parts In-Stock

1+ parts

$1.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,589

$1.680

-

-

-

Corphita

USA . 2,085 parts In-Stock

1+ parts

$1.784

100+ parts

-

1k+ parts

-

10k+ parts

-

2,085

$1.784

-

-

-

Corohmni

South Africa . 263 parts In-Stock

1+ parts

$1.982

100+ parts

-

1k+ parts

-

10k+ parts

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263

$1.982

-

-

-

Microchip USA

USA . 1,420 parts In-Stock

1+ parts

$16.445

100+ parts

-

1k+ parts

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10k+ parts

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1,420

$16.445

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,826 parts In-Stock

1+ parts

-

100+ parts

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27,826

-

-

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SupplyDigital Components

Austria . 7,542 parts In-Stock

1+ parts

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7,542

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Kulean Microsystems

USA . 7,303 parts In-Stock

1+ parts

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7,303

-

-

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Problanco Electronics

Mexico . 6,563 parts In-Stock

1+ parts

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6,563

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TANS Electronics

Latvia . 6,002 parts In-Stock

1+ parts

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6,002

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-

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-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

-

-

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Perfect Parts

USA . 3,192 parts In-Stock

1+ parts

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3,192

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-

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Lixinc

USA . 2,822 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,822

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-

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Supply Digital

USA . 2,459 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,459

-

-

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UHIMA Technologies

Türkiye . 460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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460

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

-

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-

-

Overview

Unlock the power of precision and reliability with the FSFR1800HS by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and performance in all their products. The FSFR1800HS falls under the category of Peripheral Drivers, offering built-in protections such as over current, over voltage, thermal, and under voltage. With 9 terminals in a rectangular package shape, this product is perfect for a wide range of applications. Experience seamless operation and peace of mind with the FSFR1800HS, providing unmatched value and benefits to customers looking for a high-quality solution in peripheral drivers.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape makes the product easy to mount and install in various applications.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of the peripheral driver and connected components by preventing damage from various electrical faults.

No. of Terminals: 9

The 9 terminals provide flexibility in connecting the peripheral driver to external devices or systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting of the peripheral driver, making it suitable for industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a reliable connection and prevents corrosion, ensuring long-term performance of the peripheral driver.

Terminal Position: ZIG-ZAG

The zig-zag terminal position facilitates easy and efficient connections, reducing installation time and effort.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for sturdy and reliable connections, making the peripheral driver suitable for rugged environments.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge based interface IC type offers efficient control over the peripherals, enhancing the overall performance of the connected devices.

Output Current Flow Direction: SOURCE AND SINK

The source and sink current flow direction allows for bidirectional current flow, enabling the peripheral driver to control various types of loads effectively.

Technical Specifications

Peripheral Drivers FSFR1800HS attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-XZFM-T9

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

9

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

FSFR1800HS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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