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TPS27S100ARRKT

Texas Instruments

TPS27S100ARRKT by Texas Instruments

TPS27S100ARRKT by Texas Instruments is a high-side driver with built-in protections for transient, over current, thermal, and under voltage. It operates b/w -40 to 125°C and supports a supply voltage range of 4-40V. This peripheral driver in chip carrier package is ideal for automotive applications requiring fast turn-on/off times.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,500 parts In-Stock

1+ parts

$2.119

100+ parts

$1.750

1k+ parts

$0.946

10k+ parts

-

24,500

$2.119

$1.750

$0.946

-

DigiKey

USA . 1,679 parts In-Stock

1+ parts

$2.950

100+ parts

$1.814

1k+ parts

$1.628

10k+ parts

$1.519

1,679

$2.950

$1.814

$1.628

$1.519

Mouser Electronics

USA . 656 parts In-Stock

1+ parts

$2.950

100+ parts

$1.820

1k+ parts

$1.570

10k+ parts

$1.510

656

$2.950

$1.820

$1.570

$1.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.755

-

-

-

Digiode

USA . 1,016 parts In-Stock

1+ parts

$2.013

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

$2.013

-

-

-

Vyrian

USA . 9,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,829 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

$1.720

6,829

$1.755

-

-

$1.720

Argo Parts USA

USA . 2,771 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

2,771

$1.755

-

-

-

Ampacity Inc.

Singapore . 9,180 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

9,180

$1.800

-

-

-

Semicontronic

India . 8,844 parts In-Stock

1+ parts

$1.800

100+ parts

$1.755

1k+ parts

$1.746

10k+ parts

-

8,844

$1.800

$1.755

$1.746

-

Corphita

USA . 1,447 parts In-Stock

1+ parts

$1.907

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

$1.907

-

-

-

Parana Technologies

USA . 738 parts In-Stock

1+ parts

$3.752

100+ parts

-

1k+ parts

$4.249

10k+ parts

-

738

$3.752

-

$4.249

-

Corohmni

South Africa . 899 parts In-Stock

1+ parts

$4.028

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$4.028

-

-

-

DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$4.132

100+ parts

$3.801

1k+ parts

-

10k+ parts

-

560

$4.132

$3.801

-

-

ChromeModa Solutions

Germany . 6,956 parts In-Stock

1+ parts

$4.216

100+ parts

$3.457

1k+ parts

-

10k+ parts

-

6,956

$4.216

$3.457

-

-

IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$4.216

100+ parts

-

1k+ parts

$3.794

10k+ parts

-

1,397

$4.216

-

$3.794

-

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$7.125

100+ parts

$6.768

1k+ parts

$6.768

10k+ parts

-

650

$7.125

$6.768

$6.768

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.720

1k+ parts

$1.667

10k+ parts

$1.632

100

-

$1.720

$1.667

$1.632

Overview

Unlock the power of advanced peripheral drivers with the TPS27S100ARRKT by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers top-notch solutions for a wide range of applications. This high-performance chip carrier offers built-in protections against transient events, over current, thermal issues, and more. Whether you're looking to enhance your automotive systems or optimize industrial equipment, this versatile peripheral driver is designed to meet your needs. Trust in Texas Instruments to provide reliable, cutting-edge technology that adds value and efficiency to your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting onto PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 40 V

Can handle high voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Standard shape that is easy to handle and integrate into existing designs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Ensures the safety and durability of the device by protecting it from various faults and conditions.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Efficient package design that helps in heat dissipation and overall performance of the device.

Minimum Supply Voltage: 4 V

Can operate at low voltage levels, increasing energy efficiency and flexibility in power source selection.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, increasing versatility in deployment.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable and corrosion-resistant finish that ensures reliable electrical connections.

Terminal Position: QUAD

Optimal terminal layout for easy integration and connection to external components.

High Side Driver: YES

Allows for controlling high-side loads in a circuit, expanding the range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process for reliable connection.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering process without damage.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for performance and reliability in vehicle applications.

Terminal Form: NO LEAD

Lead-free terminals for compliance with environmental regulations and consumer safety.

Nominal Supply Voltage: 24 V

Standard voltage level that is commonly used in industrial and automotive applications.

Turn-on Time: 80 us

Fast turn-on time for quick response in controlling connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Flexible interface options for compatibility with different types of control systems.

Turn-off Time: 50 us

Fast turn-off time for efficient switching of connected devices.

Output Current Flow Direction: SINK

Sink-type output for handling current flow from connected devices, providing control and protection.

Technical Specifications

Peripheral Drivers TPS27S100ARRKT attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

High Side Driver:

YES

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

50 us

Turn-on Time:

80 us

Trade Compliance

TPS27S100ARRKT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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