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BTS3408GXT

Infineon Technologies

BTS3408GXT by Infineon Technologies

BTS3408GXT by Infineon is a peripheral driver with 60V max supply voltage, built-in protections, and 0.55A nominal output peak current limit. It is used as a buffer or inverter-based peripheral driver in various applications requiring sink output current flow direction. The small outline package style makes it suitable for compact designs with its 1.75mm max seated height and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 4,807 parts In-Stock

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Vyrian

USA . 613 parts In-Stock

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Digiode

USA . 144 parts In-Stock

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Nova Conductors

Japan . 96 parts In-Stock

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Corohmni

South Africa . 1,224 parts In-Stock

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$5.811

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$5.811

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Modulus Dynamics

Lithuania . 518 parts In-Stock

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$9.331

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$8.958

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$8.585

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518

$9.331

$8.958

$8.585

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AZTECH Wire

Italy . 725 parts In-Stock

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$9.468

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725

$9.468

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$10.167

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$9.659

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$9.659

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50

$10.167

$9.659

$9.659

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Aztec Data Supply Inc.

USA . 183 parts In-Stock

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$10.230

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Ampacity Inc.

Singapore . 826 parts In-Stock

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$14.500

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Semicontronic

India . 1,438 parts In-Stock

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$19.500

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$19.012

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$18.915

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$18.915

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Continental Prestige Electronics

USA . 6,536 parts In-Stock

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Argo Parts USA

USA . 2,201 parts In-Stock

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Corphita

USA . 990 parts In-Stock

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990

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your electronic designs with the BTS3408GXT by Infineon Technologies, a top-tier manufacturer known for its cutting-edge technology and reliable products. As a leading peripheral driver in the industry, this versatile component offers built-in protections against transient events, over current, over voltage, and thermal issues. With a compact package style and dual terminal position, this small outline device is perfect for a wide range of applications. Experience the value and benefits of the BTS3408GXT and take your projects to the next level with enhanced performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 60 V

Can handle high voltage inputs, making it versatile for various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures the safety of the connected devices by preventing damage from power surges, overloads, and overheating.

No. of Terminals: 8

Offers flexibility in connecting to other components, allowing for customized configurations.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board, ideal for applications with limited area.

Nominal Supply Voltage: 5 V

Standard voltage requirement commonly used in many electronic systems, ensuring compatibility.

Turn-on Time: 8 us

Fast response time ensures efficient operation and quick activation of connected devices.

Output Current Flow Direction: SINK

Provides a reliable way to control and regulate current flow, ensuring proper functioning of the connected devices.

Technical Specifications

Peripheral Drivers BTS3408GXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.55 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

60 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

8 us

Turn-on Time:

8 us

Width:

4 mm

Trade Compliance

BTS3408GXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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