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FSFR1700XS

Onsemi

FSFR1700XS by Onsemi

FSFR1700XS by Onsemi is a peripheral driver with 9 terminals in a rectangular package. It offers built-in protections for over current, over voltage, and thermal issues. Ideal for applications requiring a half bridge based peripheral driver with source and sink output current flow direction.

Median Price

$2.732

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,683 parts In-Stock

1+ parts

$4.810

100+ parts

$3.350

1k+ parts

$2.650

10k+ parts

$2.250

1,683

$4.810

$3.350

$2.650

$2.250

Rochester

USA . 8,742 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

8,742

-

$2.240

$2.010

$1.890

DigiKey

USA . 8,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.950

10k+ parts

-

8,685

-

-

$2.950

-

Verical

USA . 3,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

$2.362

3,937

-

-

$2.513

$2.362

RS (Exports)

UK . 205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

205

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,802 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

10k+ parts

-

1,802

$2.375

-

-

-

Vyrian

USA . 1,789 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,789

$2.500

-

-

-

Ashlea Components Ltd

UK . 62 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,756 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

2,756

$2.250

-

-

-

Corohmni

South Africa . 264 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$2.500

-

-

-

Microchip USA

USA . 1,767 parts In-Stock

1+ parts

$16.900

100+ parts

$16.800

1k+ parts

$16.740

10k+ parts

$16.690

1,767

$16.900

$16.800

$16.740

$16.690

Metaverse IC Inc.

Canada . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,500

-

-

-

-

TANS Electronics

Latvia . 8,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,103

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

SupplyDigital Components

Austria . 7,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,176

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,391

-

-

-

-

Alle Elektronik GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Perfect Parts

USA . 4,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,553

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Kulean Microsystems

USA . 3,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,460

-

-

-

-

Northwest PG Solutions

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

-

-

-

-

Supply Digital

USA . 1,604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

-

-

-

-

Native Components

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

379

-

-

-

-

Problanco Electronics

Mexico . 148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

148

-

-

-

-

UHIMA Technologies

Türkiye . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Overview

Unlock the potential of your electronic devices with the FSFR1700XS by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers reliable and durable peripheral drivers that are perfect for a wide range of applications. From over current protection to thermal safeguards, this product ensures the safety and longevity of your systems. Trust in the value and benefits that Onsemi offers, and experience the advantages that the FSFR1700XS brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making the product easy to handle and long-lasting.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient space utilization and easy integration into various devices and systems.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections against over current, over voltage, and thermal issues help in ensuring the safety and longevity of the connected peripherals and overall system.

No. of Terminals: 9

The 9 terminals provide sufficient connectivity options for various peripherals and enable easy and versatile installation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables secure and stable mounting of the driver, reducing the risk of disconnection or damage during operation.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures good electrical conductivity and corrosion resistance, contributing to the reliability and performance of the product over time.

Terminal Position: ZIG-ZAG

The zig-zag terminal position facilitates efficient routing and connection of wires, reducing the risk of short circuits and ensuring better signal integrity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides a secure mechanical connection, enhancing the overall reliability of the driver.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The use of a half-bridge based interface IC type offers efficient power management and control capabilities, allowing for precise and reliable operation of the connected peripherals.

Output Current Flow Direction: SOURCE AND SINK

The ability to handle both source and sink current flow directions makes the driver versatile and suitable for a wide range of peripheral applications, providing flexibility in usage.

Technical Specifications

Peripheral Drivers FSFR1700XS attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PZFM-T9

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

9

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

FSFR1700XS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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