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FSFR2100XSL

Onsemi

FSFR2100XSL by Onsemi

FSFR2100XSL by Onsemi is a half bridge based peripheral driver with 9 terminals in a rectangular package. It offers over current, over voltage, and thermal protections. Ideal for applications requiring source and sink output current flow direction control.

Median Price

$2.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 10,110 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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$2.830

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600

$2.830

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Chip Stock

USA . 13,540 parts In-Stock

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Vyrian

USA . 9,759 parts In-Stock

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Flip Electronics

USA . 7,779 parts In-Stock

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7,779

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Digiode

USA . 370 parts In-Stock

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370

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Distributors (Availability)

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Corohmni

South Africa . 213 parts In-Stock

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$2.230

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213

$2.230

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Continental Prestige Electronics

USA . 1,637 parts In-Stock

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$2.771

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$2.716

1,637

$2.771

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$2.716

Argo Parts USA

USA . 100 parts In-Stock

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$2.771

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$2.771

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Netroflash

USA . 100 parts In-Stock

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$2.830

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$2.688

10k+ parts

$2.632

100

$2.830

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$2.688

$2.632

Advanced Electronics

New Zealand . 57 parts In-Stock

1+ parts

$2.831

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$2.831

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$2.831

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57

$2.831

$2.831

$2.831

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Aztec Data Supply Inc.

USA . 1,086 parts In-Stock

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$9.069

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$9.069

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Semicontronic

India . 9,830 parts In-Stock

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$19.500

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$19.012

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$18.915

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9,830

$19.500

$19.012

$18.915

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Microchip USA

USA . 323 parts In-Stock

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$29.840

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$29.650

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$29.560

10k+ parts

$29.470

323

$29.840

$29.650

$29.560

$29.470

Ampacity Inc.

Singapore . 9,758 parts In-Stock

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$39.500

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9,758

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,549 parts In-Stock

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SupplyDigital Components

Austria . 8,015 parts In-Stock

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Problanco Electronics

Mexico . 7,117 parts In-Stock

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Kulean Microsystems

USA . 6,820 parts In-Stock

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TANS Electronics

Latvia . 5,929 parts In-Stock

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Supply Digital

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Corphita

USA . 1,852 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,823 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,215 parts In-Stock

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Perfect Parts

USA . 1,111 parts In-Stock

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UHIMA Technologies

Türkiye . 441 parts In-Stock

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Authorized Procurement Solutions

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Eastek

USA . 114 parts In-Stock

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GreenTree Electronics

Israel . 63 parts In-Stock

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Overview

Enhance your electronic projects with the FSFR2100XSL by Onsemi, a high-quality peripheral driver that offers reliable performance and built-in protections against over current, over voltage, and thermal issues. Manufactured by Onsemi, a trusted name in the industry, this product is designed for a wide range of applications, providing exceptional value and benefits to customers. With its sleek rectangular shape and flange mount package style, this peripheral driver is a must-have for anyone looking to optimize their circuit designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this peripheral driver lightweight and durable, ideal for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various electronic devices, saving space and improving efficiency.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL

With built-in protections against over current, over voltage, and thermal issues, this peripheral driver ensures the safety and longevity of connected devices.

No. of Terminals: 9

The nine terminals provide flexibility and compatibility for a wide range of applications, making this peripheral driver versatile and functional.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options, ensuring stability and reliability in different environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent conductivity and corrosion resistance, contributing to the overall performance and longevity of the peripheral driver.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient and organized connections, reducing the risk of short circuits and improving overall system reliability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and ensures a secure connection, making this peripheral driver user-friendly and easy to work with.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge based interface IC type offers efficient power management and control, making this peripheral driver an optimal choice for various electronic applications.

Output Current Flow Direction: SOURCE AND SINK

The ability of the peripheral driver to both source and sink current allows for versatile and dynamic performance, ensuring compatibility with a wide range of electronic devices.

Technical Specifications

Peripheral Drivers FSFR2100XSL attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PZFM-T9

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

9

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

FSFR2100XSL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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