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BTS640S2

Infineon Technologies

BTS640S2 by Infineon Technologies

BTS640S2 by Infineon Technologies is a MOS technology-based peripheral driver with built-in protections for over current, over voltage, thermal, and under voltage. It operates at supply voltages of 5-34 V and can handle a max output current of 4 A. This rectangular package style flange mount device is ideal for applications requiring source flow direction such as buffer or inverter based interface ICs.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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VNN

France . 1,086 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

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Vyrian

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Zilex Electronics Inc.

Canada . 44 parts In-Stock

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Q Components

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Digital Electronic Gebert Verwaltungs UG

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Modulus Dynamics

Lithuania . 212 parts In-Stock

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$8.716

100+ parts

$8.367

1k+ parts

$8.019

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$8.716

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$8.019

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AZTECH Wire

Italy . 545 parts In-Stock

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$9.866

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Advanced Electronics

New Zealand . 34 parts In-Stock

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$11.611

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$10.566

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$9.521

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Ampacity Inc.

Singapore . 993 parts In-Stock

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$32.500

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Andel Nordic

Denmark . 4,630 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,563 parts In-Stock

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Continental Prestige Electronics

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Glotronic Ltd.

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Argo Parts USA

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Kepictronics

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Alle Elektronik GmbH

Germany . 1,540 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the Infineon Technologies BTS640S2, a top-of-the-line peripheral driver designed to exceed your expectations. With built-in protections against over current, over voltage, thermal issues, and under voltage, this product ensures maximum safety and reliability. Ideal for a wide range of applications, the BTS640S2 offers a nominal output peak current limit of 50A and a maximum supply voltage of 34V, making it perfect for high-performance systems. Trust in Infineon Technologies' reputation for excellence and innovation, and experience the value and benefits that the BTS640S2 can bring to your projects. Elevate your designs with the BTS640S2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Maximum Supply Voltage: 34 V

With a maximum supply voltage of 34 V, this peripheral driver can handle higher voltage inputs, making it versatile for a variety of applications.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of the connected devices by preventing damage from overcurrent, overvoltage, thermal issues, and undervoltage situations.

Power Supplies (V): 12/24

Support for 12/24 V power supplies makes this peripheral driver compatible with a wide range of systems and components.

No. of Terminals: 7

Seven terminals provide flexibility for connecting multiple devices or components to the peripheral driver.

Maximum Output Current: 4 A

The high maximum output current of 4 A allows the peripheral driver to power demanding devices or components effectively.

Technology: MOS

MOS technology ensures efficient operation and low power consumption for the peripheral driver.

Nominal Supply Voltage: 12 V

The nominal 12 V supply voltage is a common standard in many systems, making this peripheral driver easily compatible.

Turn-on Time: 150 us

Fast turn-on time of 150 us ensures quick response and activation of connected devices.

Nominal Output Peak Current Limit: 50 A

With a peak current limit of 50 A, this peripheral driver can handle temporary high-demand situations without risk of damage.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type allows for smooth communication and signal processing between devices and the peripheral driver.

Turn-off Time: 200 us

Short turn-off time of 200 us ensures quick deactivation of connected devices when needed.

Output Current Flow Direction: SOURCE

Source current flow direction ensures that the peripheral driver provides power to connected devices in an efficient and effective manner.

Technical Specifications

Peripheral Drivers BTS640S2 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PZFM-T7

No. of Functions:

1

No. of Terminals:

7

Output Current Flow Direction:

SOURCE

Maximum Output Current:

4 A

Nominal Output Peak Current Limit:

50 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP7,.15,.2TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

12/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Turn-off Time:

200 us

Turn-on Time:

150 us

Trade Compliance

BTS640S2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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