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FPF1107

Onsemi

FPF1107 by Onsemi

FPF1107 by Onsemi is a peripheral driver with 4 terminals, operating voltage of 1.2/4V, and peak reflow temperature of 260°C. It is used in industrial applications requiring buffer or inverter-based interface ICs for sink output current flow direction.

Median Price

$0.164

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 169,659 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.141

10k+ parts

$0.125

169,659

-

$0.170

$0.141

$0.125

DigiKey

USA . 167,160 parts In-Stock

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$0.210

167,160

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$0.210

Verical

USA . 162,860 parts In-Stock

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$0.157

162,860

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$0.157

Mouser Electronics

USA . 306 parts In-Stock

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$0.129

306

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$0.129

Distributors (In-Stock)

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Digiode

USA . 2,481 parts In-Stock

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$0.139

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2,481

$0.139

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Bristol Electronics

USA . 2,125 parts In-Stock

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$0.475

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$0.176

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$0.123

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2,125

$0.475

$0.176

$0.123

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Vyrian

USA . 107,084 parts In-Stock

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107,084

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Flip Electronics

USA . 18,000 parts In-Stock

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Chip Stock

USA . 4,403 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,975 parts In-Stock

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2,975

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Dan-Mar Components

USA . 2,975 parts In-Stock

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2,975

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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Ampacity Inc.

Singapore . 107,414 parts In-Stock

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$0.110

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107,414

$0.110

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Semicontronic

India . 107,023 parts In-Stock

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$0.110

100+ parts

$0.107

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$0.107

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107,023

$0.110

$0.107

$0.107

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Corohmni

South Africa . 466 parts In-Stock

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$0.129

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466

$0.129

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Corphita

USA . 424 parts In-Stock

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$0.131

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424

$0.131

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Aztec Data Supply Inc.

USA . 2,177 parts In-Stock

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$8.785

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2,177

$8.785

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,959 parts In-Stock

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Problanco Electronics

Mexico . 7,095 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,947 parts In-Stock

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SupplyDigital Components

Austria . 6,039 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,383 parts In-Stock

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TANS Electronics

Latvia . 5,280 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,631 parts In-Stock

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Microchip USA

USA . 3,791 parts In-Stock

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Argo Parts USA

USA . 2,570 parts In-Stock

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Supply Digital

USA . 1,206 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Kulean Microsystems

USA . 127 parts In-Stock

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UHIMA Technologies

Türkiye . 64 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality FPF1107 from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers reliable and efficient products that excel in various applications. The FPF1107, belonging to the category of Peripheral Drivers, offers unparalleled value with its advanced features and benefits. With a wide operating temperature range and innovative terminal finish, this product ensures optimal performance in industrial settings. Upgrade your designs with the FPF1107 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat and chemicals, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square shape is versatile and compact, fitting well into various device designs.

Power Supplies (V): 1.2/4

Supports different voltage requirements, offering flexibility in powering the peripheral driver.

No. of Terminals: 4

Simplifies circuit connections and reduces potential points of failure.

Package Style (Meter): GRID ARRAY

Grid array design provides good electrical performance and thermal management.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various conditions.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for stable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper reflow soldering within a predefined time limit for optimal performance.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures to achieve reliable solder joints.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and durability.

Terminal Form: BALL

Ball-shaped terminals provide good contact area and reliability in connections.

Terminal Pitch: 0.5 mm

Fine pitch allows for compact design and precise connection spacing.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type for driving peripheral devices efficiently.

Output Current Flow Direction: SINK

Sink output current flow direction ensures proper functioning and protection of connected devices.

Technical Specifications

Peripheral Drivers FPF1107 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/4

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FPF1107 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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