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NCP451AFCT2G

Onsemi

NCP451AFCT2G by Onsemi

NCP451AFCT2G by Onsemi is a Power Management IC with 6 terminals, Vsup range of 0.75V to 5.5V, and operating temp from -40°C to 85°C. It features a GRID ARRAY package style suitable for power supply support circuits in various applications.

Median Price

$0.443

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 554 parts In-Stock

1+ parts

$0.570

100+ parts

$0.311

1k+ parts

$0.264

10k+ parts

-

554

$0.570

$0.311

$0.264

-

Mouser Electronics

USA . 371 parts In-Stock

1+ parts

$0.570

100+ parts

$0.313

1k+ parts

$0.290

10k+ parts

-

371

$0.570

$0.313

$0.290

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EBV Elektronik

Germany . 51,000 parts In-Stock

1+ parts

-

100+ parts

-

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51,000

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-

-

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Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.239

6,000

-

-

-

$0.239

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.183

3,000

-

-

-

$0.183

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.400

10k+ parts

$0.366

3,000

-

-

$0.400

$0.366

Master Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.486

1k+ parts

$0.340

10k+ parts

$0.277

3,000

-

$0.486

$0.340

$0.277

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.289

100+ parts

-

1k+ parts

-

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300

$0.289

-

-

-

TME

Poland . 2,994 parts In-Stock

1+ parts

$0.530

100+ parts

$0.303

1k+ parts

$0.291

10k+ parts

-

2,994

$0.530

$0.303

$0.291

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Digiode

USA . 1,651 parts In-Stock

1+ parts

$0.608

100+ parts

-

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1,651

$0.608

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Chip Stock

USA . 408,164 parts In-Stock

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408,164

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NAC Semi

USA . 27,000 parts In-Stock

1+ parts

-

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$0.568

27,000

-

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-

$0.568

Vyrian

USA . 19,210 parts In-Stock

1+ parts

-

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19,210

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Sensible Micro Corp

USA . 6,000 parts In-Stock

1+ parts

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6,000

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.268

3,000

-

-

-

$0.268

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,065 parts In-Stock

1+ parts

$0.136

100+ parts

-

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19,065

$0.136

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$0.208

100+ parts

-

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394

$0.208

-

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Continental Prestige Electronics

USA . 6,824 parts In-Stock

1+ parts

$0.278

100+ parts

-

1k+ parts

-

10k+ parts

$0.272

6,824

$0.278

-

-

$0.272

Argo Parts USA

USA . 4,948 parts In-Stock

1+ parts

$0.278

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

4,948

$0.278

-

-

$0.270

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

$0.272

10k+ parts

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50

$0.283

-

$0.272

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Corphita

USA . 116 parts In-Stock

1+ parts

$0.576

100+ parts

-

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116

$0.576

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Vigor

Singapore . 142 parts In-Stock

1+ parts

$0.600

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142

$0.600

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Microchip USA

USA . 5,382 parts In-Stock

1+ parts

$1.698

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5,382

$1.698

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RC Electronics

USA . 87,619 parts In-Stock

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87,619

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Perfect Parts

USA . 45,394 parts In-Stock

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GreenTree Electronics

Israel . 23,611 parts In-Stock

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Lixinc

USA . 12,856 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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TANS Electronics

Latvia . 5,948 parts In-Stock

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5,948

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,320 parts In-Stock

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3,320

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Formix International (Excess)

India . 2,811 parts In-Stock

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2,811

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SupplyDigital Components

Austria . 2,243 parts In-Stock

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2,243

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Problanco Electronics

Mexico . 1,904 parts In-Stock

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1,904

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UHIMA Technologies

Türkiye . 779 parts In-Stock

1+ parts

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779

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Overview

Enhance your power management solutions with the NCP451AFCT2G from Onsemi. Crafted with precision and reliability in mind, this Power Management IC offers superior performance and efficiency for various applications. Whether you're looking to optimize energy consumption or improve system reliability, this product is the perfect choice. With its advanced features and durable design, the NCP451AFCT2G guarantees top-notch performance and long-term value. Trust Onsemi's expertise and experience in the industry to deliver a product that exceeds expectations every time. Elevate your power management capabilities with the NCP451AFCT2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, perfect for applications where space is limited.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage of 3.6V, this product is compatible with a wide range of power sources, increasing its versatility.

No. of Terminals: 6

Having 6 terminals enables efficient connectivity and communication with other components in the system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch layout offers high performance in a small form factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity, promoting efficient power transmission.

Terminal Position: BOTTOM

The terminal position on the bottom allows for easy mounting on the PCB, simplifying the assembly process.

Maximum Seated Height: 0.51 mm

The maximum seated height of 0.51mm ensures a low profile design, ideal for space-constrained applications.

Width (mm): 0.9 mm

With a width of only 0.9mm, this product is compact and can fit into tight spaces without sacrificing performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

The additional power supply support circuit enhances the overall functionality and reliability of the product.

Minimum Supply Voltage (Vsup): 0.75 V

The minimum supply voltage of 0.75V ensures compatibility with lower power sources, making this product versatile for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The high reflow temperature allows for quick and efficient soldering, reducing assembly time.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without damage.

Length: 1.4 mm

The length of 1.4mm provides a balance between compactness and functionality, making this product suitable for a wide range of applications.

Terminal Form: BALL

The terminal form of a ball ensures secure connections and strong mechanical stability, enhancing the overall durability of the product.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for precise placement on the PCB, ensuring reliable electrical connections.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product can handle a wide range of power inputs, making it versatile for different applications.

Technical Specifications

Power Management ICs NCP451AFCT2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e1

Length:

1.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.51 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.75 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.9 mm

Trade Compliance

NCP451AFCT2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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