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NCP4545IMNTWG-L

Onsemi

NCP4545IMNTWG-L by Onsemi

NCP4545IMNTWG-L by Onsemi is a Power Management IC with 3.3V nominal voltage, 18 terminals, and 70 °C max operating temp. Ideal for power supply support circuits in commercial applications due to its compact square shape, low profile design, and surface mount capability.

Median Price

$1.339

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 85 parts In-Stock

1+ parts

$1.700

100+ parts

$1.130

1k+ parts

-

10k+ parts

$0.762

85

$1.700

$1.130

-

$0.762

Flip Electronics (Authorized)

USA . 77,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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77,126

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-

-

-

Rochester

USA . 10,760 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.812

10k+ parts

$0.724

10,760

-

$0.978

$0.812

$0.724

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,922 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

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10k+ parts

-

1,922

$0.762

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-

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Vyrian

USA . 1,533 parts In-Stock

1+ parts

$0.802

100+ parts

-

1k+ parts

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1,533

$0.802

-

-

-

Flip Electronics

USA . 77,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

77,126

-

-

-

-

Bristol Electronics

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$1.006

1k+ parts

$0.563

10k+ parts

$0.531

2,800

-

$1.006

$0.563

$0.531

Dan-Mar Components

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

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2,800

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-

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Netsource Technology, Inc.

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

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1,731

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,332 parts In-Stock

1+ parts

$0.722

100+ parts

-

1k+ parts

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10k+ parts

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2,332

$0.722

-

-

-

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$0.802

100+ parts

-

1k+ parts

-

10k+ parts

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102

$0.802

-

-

-

SupplyDigital Components

Austria . 7,812 parts In-Stock

1+ parts

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100+ parts

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7,812

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Kulean Microsystems

USA . 5,891 parts In-Stock

1+ parts

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5,891

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TANS Electronics

Latvia . 4,315 parts In-Stock

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4,315

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UHIMA Technologies

Türkiye . 799 parts In-Stock

1+ parts

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799

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Problanco Electronics

Mexico . 55 parts In-Stock

1+ parts

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55

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Overview

Enhance the performance of your power management systems with the NCP4545IMNTWG-L from Onsemi. As a leading manufacturer in Power Management ICs, Onsemi delivers top-quality products like this with a square package shape, very thin profile, and matte tin terminal finish. Ideal for various applications, this POWER SUPPLY SUPPORT CIRCUIT offers reliability and efficiency in maintaining a nominal supply voltage of 3.3V. With a sleek design and advanced technology, customers can trust in the value and benefits that this innovative product brings to their projects.

Feature Benefit Bullets

Surface Mount : YES

This product can be easily mounted on a PCB, making it suitable for automated assembly processes.

Nominal Supply Voltage (Vsup) : 3.3 V

This specific voltage range is commonly used in many electronic devices, making it versatile for various applications.

Maximum Operating Temperature : 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Terminal Finish : MATTE TIN

The matte tin finish provides good solderability and electrical conductivity for reliable connections.

Width (mm) : 3 mm

The compact width of the package makes it suitable for space-constrained designs.

Package Style : CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in thermal management and overall design options.

Temperature Grade : COMMERCIAL

This temperature grade indicates that the product is suitable for standard commercial applications.

Technical Specifications

Power Management ICs NCP4545IMNTWG-L attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N18

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NCP4545IMNTWG-L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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