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NCP451FCT2G

Onsemi

NCP451FCT2G by Onsemi

NCP451FCT2G by Onsemi is a Power Management IC with 6 terminals, Vsup range of 0.75V to 5.5V, and operating temp from -40°C to 85°C. It features a very thin profile grid array package suitable for industrial applications like power supply support circuits.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,649 parts In-Stock

1+ parts

$0.540

100+ parts

$0.293

1k+ parts

$0.249

10k+ parts

$0.227

5,649

$0.540

$0.293

$0.249

$0.227

Mouser Electronics

USA . 2,224 parts In-Stock

1+ parts

$1.140

100+ parts

$0.444

1k+ parts

$0.303

10k+ parts

$0.230

2,224

$1.140

$0.444

$0.303

$0.230

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.349

15,000

-

-

-

$0.349

EBV Elektronik

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,000

-

-

-

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Flip Electronics (Authorized)

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

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780

-

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Rochester

USA . 257 parts In-Stock

1+ parts

-

100+ parts

$0.280

1k+ parts

$0.233

10k+ parts

$0.207

257

-

$0.280

$0.233

$0.207

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,993 parts In-Stock

1+ parts

$0.218

100+ parts

-

1k+ parts

-

10k+ parts

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1,993

$0.218

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$0.280

100+ parts

-

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450

$0.280

-

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Vyrian

USA . 17,049 parts In-Stock

1+ parts

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17,049

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-

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Sensible Micro Corp

USA . 7,580 parts In-Stock

1+ parts

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7,580

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Chip Stock

USA . 7,290 parts In-Stock

1+ parts

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7,290

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.446

6,000

-

-

-

$0.446

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.205

3,000

-

-

-

$0.205

Flip Electronics

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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780

-

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Speed Components Ltd

Israel . 500 parts In-Stock

1+ parts

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100+ parts

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500

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,096 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

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10k+ parts

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17,096

$0.176

-

-

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Semicontronic

India . 17,056 parts In-Stock

1+ parts

$0.176

100+ parts

$0.172

1k+ parts

$0.171

10k+ parts

-

17,056

$0.176

$0.172

$0.171

-

Corphita

USA . 1,920 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$0.206

-

-

-

Corohmni

South Africa . 164 parts In-Stock

1+ parts

$0.214

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$0.214

-

-

-

Argo Parts USA

USA . 2,465 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

$0.272

2,465

$0.280

-

-

$0.272

Continental Prestige Electronics

USA . 1,509 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

$0.274

1,509

$0.280

-

-

$0.274

Vigor

Singapore . 172 parts In-Stock

1+ parts

$0.600

100+ parts

-

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172

$0.600

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Aztec Data Supply Inc.

USA . 205 parts In-Stock

1+ parts

$1.300

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205

$1.300

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QUARKTWIN TECHNOLOGY LTD

USA . 16,063 parts In-Stock

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16,063

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Microchip USA

USA . 6,779 parts In-Stock

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6,779

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Problanco Electronics

Mexico . 6,025 parts In-Stock

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6,025

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Kulean Microsystems

USA . 5,935 parts In-Stock

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5,935

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Lixinc

USA . 5,762 parts In-Stock

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5,762

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TANS Electronics

Latvia . 3,877 parts In-Stock

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3,877

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SupplyDigital Components

Austria . 2,046 parts In-Stock

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2,046

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Kepictronics

USA . 1,400 parts In-Stock

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1,400

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 886 parts In-Stock

1+ parts

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886

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UHIMA Technologies

Türkiye . 504 parts In-Stock

1+ parts

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504

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-

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GreenTree Electronics

Israel . 5 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5

-

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-

-

Overview

Enhance your power management solutions with the NCP451FCT2G by Onsemi. Crafted with precision and expertise, this power management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures efficient performance and optimal power supply support. With a compact package style and advanced features, the NCP451FCT2G provides customers with exceptional value, benefits, and advantages. Choose Onsemi for cutting-edge technology and superior products that meet all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

The rectangular shape is space-saving and easy to mount on a circuit board.

Nominal Supply Voltage (Vsup): 3.6 V

Operating within a range of 3.6V makes it suitable for a variety of applications.

No. of Terminals: 6

Having six terminals offers flexibility in connecting to other components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style allows for compact design and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

With a high operating temperature, this product is reliable in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for use in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

The use of these materials ensures good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering onto the PCB.

Maximum Seated Height: 0.5 mm

The low profile design is ideal for applications with space constraints.

Width (mm): 0.9 mm

With a narrow width, this product can be used in compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type provides support for power supply functions, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 0.75 V

Operating at low voltages makes this product energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand soldering processes without damage.

Length: 1.4 mm

The compact length of this product allows for easy integration into tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions.

Terminal Form: BALL

Ball terminal form provides a reliable connection and ensures consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product is suitable for a wide range of power sources.

Technical Specifications

Power Management ICs NCP451FCT2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B6

Length:

1.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.75 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.9 mm

Trade Compliance

NCP451FCT2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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