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ISP762TXT

Infineon Technologies

ISP762TXT by Infineon Technologies

ISP762TXT by Infineon Technologies is a peripheral driver with 8 terminals, built-in transient protection, and a max supply voltage of 34V. It is used in applications requiring a small outline package style, such as buffer or inverter-based interface ICs for sink output current flow direction. Operating temperature ranges from -30 to 85°C.

Median Price

$0.776

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 112,500 parts In-Stock

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$0.776

112,500

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$0.776

Distributors (In-Stock)

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Vyrian

USA . 112,082 parts In-Stock

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112,082

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Digiode

USA . 766 parts In-Stock

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766

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Nova Conductors

Japan . 22 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 112,468 parts In-Stock

1+ parts

$0.660

100+ parts

$0.644

1k+ parts

$0.640

10k+ parts

-

112,468

$0.660

$0.644

$0.640

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Ampacity Inc.

Singapore . 112,049 parts In-Stock

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$0.660

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$0.660

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$7.716

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$7.330

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$7.330

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-

3,000

$7.716

$7.330

$7.330

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Aztec Data Supply Inc.

USA . 4,688 parts In-Stock

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$11.180

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$11.180

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Corohmni

South Africa . 271 parts In-Stock

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$14.155

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271

$14.155

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Modulus Dynamics

Lithuania . 1,289 parts In-Stock

1+ parts

$14.825

100+ parts

$14.232

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$13.639

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1,289

$14.825

$14.232

$13.639

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Argo Parts USA

USA . 3,398 parts In-Stock

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Continental Prestige Electronics

USA . 2,957 parts In-Stock

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Corphita

USA . 282 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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$8.044

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$8.044

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$8.044

100

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$8.044

$8.044

$8.044

Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the ISP762TXT from Infineon Technologies. Designed with cutting-edge technology and high-quality materials, this peripheral driver offers unrivaled protection against transients and ensures optimal performance in a compact package. Ideal for a wide range of applications, this product is guaranteed to enhance your systems with its reliable operation and efficient functionality. Trust in Infineon Technologies to deliver superior products that promise value, benefits, and advantages to all customers seeking top-notch solutions for their electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand environmental factors and provide protection to the internal components of the driver.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 34 V

Capable of handling high voltage inputs, suitable for a wide range of applications.

Built-in Protections: TRANSIENT

Provides protection against transient voltage spikes, enhancing the reliability of the driver.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring consistent performance.

Turn-on Time: 170 us

Quick turn-on time allows for rapid response to input signals, improving overall system performance.

Output Current Flow Direction: SINK

Capable of sinking higher current loads, making it suitable for driving various types of peripherals.

Technical Specifications

Peripheral Drivers ISP762TXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

8.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

34 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

230 us

Turn-on Time:

170 us

Width:

4 mm

Trade Compliance

ISP762TXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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