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NCV8401ADTRKG

Onsemi

NCV8401ADTRKG by Onsemi

NCV8401ADTRKG by Onsemi is a small outline peripheral driver with built-in protections against transient, over current, and over voltage. It has a nominal output peak current limit of 35A and turn-on time of 25us. Ideal for applications requiring buffer or inverter based interface ICs in automotive electronics due to AEC-Q101 screening level.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

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$1.000

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Vyrian

USA . 7,747 parts In-Stock

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Chip Stock

USA . 7,000 parts In-Stock

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Infinite Electronics LLP

India . 2,292 parts In-Stock

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Digiode

USA . 1,072 parts In-Stock

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Pegasus Components GmbH

Germany . 311 parts In-Stock

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Rebound Electronics

UK . 112 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 250 parts In-Stock

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$0.560

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250

$0.560

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$0.794

100+ parts

$0.754

1k+ parts

$0.754

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200

$0.794

$0.754

$0.754

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Argo Parts USA

USA . 3,737 parts In-Stock

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$1.000

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Continental Prestige Electronics

USA . 2,254 parts In-Stock

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$1.000

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$0.980

2,254

$1.000

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Modulus Dynamics

Lithuania . 650 parts In-Stock

1+ parts

$1.032

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$1.022

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$0.991

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650

$1.032

$1.022

$0.991

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Microchip USA

USA . 4,606 parts In-Stock

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$5.625

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AZTECH Wire

Italy . 671 parts In-Stock

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$7.245

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$7.245

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Ampacity Inc.

Singapore . 261 parts In-Stock

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$9.500

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$9.500

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Aztec Data Supply Inc.

USA . 344 parts In-Stock

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$13.830

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Semicontronic

India . 961 parts In-Stock

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$15.500

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$15.112

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$15.035

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Perfect Parts

USA . 124,706 parts In-Stock

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RC Electronics

USA . 78,622 parts In-Stock

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,954 parts In-Stock

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Kulean Microsystems

USA . 5,942 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 4,367 parts In-Stock

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Robosynatics

Brazil . 2,670 parts In-Stock

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Lucentia Tech

USA . 2,670 parts In-Stock

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$0.756

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$0.740

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$0.740

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$0.740

TANS Electronics

Latvia . 2,474 parts In-Stock

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SupplyDigital Components

Austria . 1,698 parts In-Stock

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Corphita

USA . 1,573 parts In-Stock

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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Corohmni

South Africa . 235 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance your electronic designs with the NCV8401ADTRKG by Onsemi, a top-quality peripheral driver that guarantees reliable performance and durability. Manufactured by industry leader Onsemi, this product offers built-in protections against transient, over current, over voltage, and thermal issues, ensuring peace of mind for customers. Ideal for a wide range of applications, this compact device is perfect for managing output currents efficiently. Don't settle for less when you can have the best - choose the NCV8401ADTRKG for superior quality and performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the peripheral driver lightweight and durable, ideal for various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections enhance the reliability and safety of the peripheral driver by safeguarding it against transient events, over current, over voltage, and thermal issues.

No. of Terminals: 2

With only 2 terminals, the peripheral driver is easy to install and reduces the complexity of the wiring setup.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good conductivity and reliable connections for the peripheral driver.

Turn-on Time: 25 us

The fast turn-on time of 25 microseconds allows the peripheral driver to respond quickly to input signals, improving overall system performance.

Technical Specifications

Peripheral Drivers NCV8401ADTRKG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

35 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q101

Maximum Seated Height:

2.51 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

180 us

Turn-on Time:

25 us

Width:

6.095 mm

Trade Compliance

NCV8401ADTRKG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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