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BTM7740G

Infineon Technologies

BTM7740G by Infineon Technologies

BTM7740G by Infineon Technologies is a MOS technology-based peripheral driver with 4 bits. It has a nominal output peak current limit of 15A and operates on power supplies ranging from 8V to 18V. This rectangular-shaped, small outline package is ideal for applications requiring source and sink output current flow direction in automotive electronics.

Median Price

$2.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 940 parts In-Stock

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$2.000

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940

$2.000

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ComSIT Distribution GmbH

Germany . 35,963 parts In-Stock

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Astute Electronics Inc

. 21,000 parts In-Stock

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Rutronik

Germany . 12,000 parts In-Stock

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$2.500

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$2.500

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VNN

France . 3,053 parts In-Stock

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3,053

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Digiode

USA . 980 parts In-Stock

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980

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Nova Conductors

Japan . 36 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 849 parts In-Stock

1+ parts

$0.425

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849

$0.425

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Modulus Dynamics

Lithuania . 355 parts In-Stock

1+ parts

$2.612

100+ parts

$2.508

1k+ parts

$2.403

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355

$2.612

$2.508

$2.403

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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$6.500

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$6.500

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Andel Nordic

Denmark . 3,353 parts In-Stock

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$31.840

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$22.285

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$22.285

3,353

$31.840

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$22.285

$22.285

A-Z Elektronik GmbH

Germany . 7,315 parts In-Stock

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Perfect Parts

USA . 5,132 parts In-Stock

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Futuretech Components

Singapore . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,125 parts In-Stock

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Corphita

USA . 781 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Enhance the performance of your electronic devices with the Infineon Technologies BTM7740G. As a trusted manufacturer in the industry, Infineon Technologies delivers top-quality peripheral drivers that guarantee reliability and efficiency. The BTM7740G is perfect for various applications, offering unparalleled value and benefits to customers. With its advanced technology and high output peak current limit, this product ensures seamless operation and optimal performance for your devices. Experience the difference with the BTM7740G from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mount compatible allows for easy installation on circuit boards, saving space and making assembly more efficient.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making it suitable for automotive applications where durability is essential.

Package Shape: RECTANGULAR

The rectangular package shape is versatile and easy to handle, making it compatible with a wide range of circuit board layouts and designs.

Power Supplies (V): 8/18

Support for power supplies ranging from 8V to 18V provides flexibility for different system requirements and voltage levels.

No. of Terminals: 28

Having 28 terminals allows for connectivity with multiple components, enabling a wide range of input and output options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices and applications.

Terminal Position: DUAL

Dual terminal position facilitates efficient signal routing and connectivity, enhancing overall performance and reliability of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260C, the peripheral driver can withstand high-temperature soldering processes without compromising functionality or durability.

Technology: MOS

MOS technology offers high-speed performance, low power consumption, and reliability, making it suitable for demanding applications where efficiency is key.

Terminal Form: GULL WING

The gull wing terminal form provides secure contact with the circuit board, ensuring stable connections and minimizing the risk of signal interference or loss.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise placement on the circuit board, enhancing ease of assembly and ensuring reliable electrical connections.

Driver No. of Bits: 4

Having 4 bits in the driver provides sufficient resolution and accuracy for signal processing and control, making it suitable for a variety of applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the peripheral driver can withstand moderate levels of moisture exposure, making it suitable for a wide range of operating environments.

Nominal Output Peak Current Limit: 15 A

The 15A peak output current limit allows for high-power operation, making the peripheral driver suitable for applications that require robust performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Support for both buffer and inverter based peripheral driver interfaces offers flexibility and compatibility with a variety of systems and devices, enhancing versatility.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current ensures bidirectional signal control and compatibility with different load types, making it a versatile choice for various applications.

Technical Specifications

Peripheral Drivers BTM7740G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/18

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

BTM7740G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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