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BTM7750GPAUMA1

Infineon Technologies

BTM7750GPAUMA1 by Infineon Technologies

Infineon's BTM7750GPAUMA1 is a peripheral driver with 2 functions, operating at supply voltages from 1.8V to 42V. It offers built-in protections against overvoltage, thermal issues, and undervoltage. This half-bridge based driver in a small outline package is ideal for applications requiring a nominal output peak current limit of 22A.

Median Price

$4.271

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.271

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500

$4.271

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Chip Stock

USA . 10,900 parts In-Stock

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10,900

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Vyrian

USA . 3,369 parts In-Stock

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3,369

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VNN

France . 1,321 parts In-Stock

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Digiode

USA . 310 parts In-Stock

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310

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,580 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

1,580

$2.500

$2.438

$2.425

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Continental Prestige Electronics

USA . 6,517 parts In-Stock

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$4.271

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$4.186

6,517

$4.271

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$4.186

Argo Parts USA

USA . 83 parts In-Stock

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$4.271

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83

$4.271

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Corohmni

South Africa . 216 parts In-Stock

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$5.638

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216

$5.638

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AZTECH Wire

Italy . 433 parts In-Stock

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$10.348

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433

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Aztec Data Supply Inc.

USA . 318 parts In-Stock

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$13.680

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318

$13.680

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Modulus Dynamics

Lithuania . 63 parts In-Stock

1+ parts

$14.421

100+ parts

$13.844

1k+ parts

$13.267

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63

$14.421

$13.844

$13.267

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Ampacity Inc.

Singapore . 210 parts In-Stock

1+ parts

$32.500

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210

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Perfect Parts

USA . 1,821 parts In-Stock

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1,821

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Netroflash

USA . 1,000 parts In-Stock

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$4.186

1k+ parts

$4.057

10k+ parts

$3.972

1,000

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$4.186

$4.057

$3.972

Corphita

USA . 438 parts In-Stock

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438

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Microchip USA

USA . 236 parts In-Stock

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Overview

Looking for a reliable and high-quality peripheral driver? Look no further than the BTM7750GPAUMA1 by Infineon Technologies. With built-in protections against overvoltage, thermal issues, and undervoltage, this product ensures smooth operation and peace of mind. Perfect for various applications, this half-bridge based peripheral driver offers a nominal output peak current limit of 22A, making it a versatile choice for your electronic needs. Trust in Infineon's expertise and choose the BTM7750GPAUMA1 for exceptional performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Surface Mount: YES

Surface mount capability makes installation and integration of this peripheral driver easier and more efficient.

Maximum Supply Voltage: 42 V

Supports a high maximum supply voltage, making it suitable for a wide range of applications.

No. of Functions: 2

Having 2 functions allows for more versatile use in different scenarios.

Built-in Protections: OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Built-in protections ensure the safety and reliability of the connected components by preventing damage from over voltage, thermal issues, and under voltage.

No. of Terminals: 15

With 15 terminals, this peripheral driver offers flexibility in connectivity and configuration.

Minimum Supply Voltage: 1.8 V

Supports a low minimum supply voltage, allowing for efficient operation even at lower power levels.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, making it user-friendly.

Maximum Seated Height: 4.4 mm

Compact design with a low seated height makes it suitable for applications with space constraints.

Width: 9.25 mm

Narrow width allows for easy integration into tight spaces or crowded PCB layouts.

Length: 21.6 mm

Optimal length for a balance between functionality and space-saving design.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during installation.

Turn-on Time: 180 us

Fast turn-on time ensures quick response and activation of functions when needed.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that this peripheral driver is moderately sensitive to moisture, but suitable for most indoor applications.

Nominal Output Peak Current Limit: 22 A

High output peak current limit of 22 A allows for efficient power delivery to connected peripherals.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half bridge based interface IC type offers reliable and efficient control over connected peripherals.

Turn-off Time: 180 us

Fast turn-off time ensures quick deactivation of functions when needed.

Output Current Flow Direction: SOURCE AND SINK

Supports bidirectional flow of output current, allowing for versatile control of connected components.

Technical Specifications

Peripheral Drivers BTM7750GPAUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G15

Length:

21.6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

15

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

22 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

4.4 mm

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

180 us

Turn-on Time:

180 us

Width:

9.25 mm

Trade Compliance

BTM7750GPAUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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