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BTM7750GXUMA1

Infineon Technologies

BTM7750GXUMA1 by Infineon Technologies

BTM7750GXUMA1 by Infineon Technologies is a 28-terminal peripheral driver with a peak current limit of 22A. It features Gull Wing terminals, source and sink output current flow direction, and is designed for buffer or inverter-based interface IC applications. The package is made of plastic/epoxy, surface mountable, with a small outline rectangular shape suitable for various electronic devices.

Median Price

$5.875

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 622 parts In-Stock

1+ parts

$3.130

100+ parts

$2.940

1k+ parts

$2.660

10k+ parts

-

622

$3.130

$2.940

$2.660

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Avnet

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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14,000

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-

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.875

10k+ parts

-

1,000

-

-

$5.875

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Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.875

10k+ parts

-

1,000

-

-

$5.875

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.030

10k+ parts

-

1,000

-

-

$6.030

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 662 parts In-Stock

1+ parts

$2.974

100+ parts

-

1k+ parts

-

10k+ parts

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662

$2.974

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

-

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50

$3.291

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-

-

Chip Stock

USA . 11,499 parts In-Stock

1+ parts

-

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11,499

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Vyrian

USA . 8,216 parts In-Stock

1+ parts

-

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8,216

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VNN

France . 2,727 parts In-Stock

1+ parts

-

100+ parts

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2,727

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,217 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

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3,217

$2.660

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-

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Semicontronic

India . 3,092 parts In-Stock

1+ parts

$2.660

100+ parts

$2.594

1k+ parts

$2.580

10k+ parts

-

3,092

$2.660

$2.594

$2.580

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Corphita

USA . 49 parts In-Stock

1+ parts

$2.817

100+ parts

-

1k+ parts

-

10k+ parts

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49

$2.817

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Argo Parts USA

USA . 4,979 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

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10k+ parts

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4,979

$3.291

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-

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Continental Prestige Electronics

USA . 3,680 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

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10k+ parts

$3.225

3,680

$3.291

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-

$3.225

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

-

10k+ parts

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100

$3.291

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-

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Modulus Dynamics

Lithuania . 4,740 parts In-Stock

1+ parts

$3.291

100+ parts

$3.159

1k+ parts

$3.028

10k+ parts

-

4,740

$3.291

$3.159

$3.028

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Corohmni

South Africa . 462 parts In-Stock

1+ parts

$3.291

100+ parts

-

1k+ parts

-

10k+ parts

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462

$3.291

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-

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Aztec Data Supply Inc.

USA . 2,859 parts In-Stock

1+ parts

$9.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,859

$9.390

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-

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AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$18.060

100+ parts

-

1k+ parts

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10k+ parts

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244

$18.060

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

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Perfect Parts

USA . 9,276 parts In-Stock

1+ parts

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100+ parts

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9,276

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Microchip USA

USA . 495 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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495

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Overview

Unlock the potential of your electronics with the BTM7750GXUMA1 by Infineon Technologies. Designed with precision and quality in mind, this peripheral driver is perfect for a wide range of applications. Whether you're looking to enhance the performance of your devices or streamline your operations, the BTM7750GXUMA1 offers unmatched value and benefits. Trust Infineon Technologies to deliver reliability, efficiency, and innovation with every product. Upgrade your technology today with the BTM7750GXUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape is common and easy to work with in various electronic designs.

No. of Terminals: 28

Having 28 terminals provides flexibility for connecting multiple components and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, ideal for compact electronic devices.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Dual terminal position enables bidirectional current flow, enhancing versatility in circuit design.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard SMT assembly processes.

Nominal Output Peak Current Limit: 22 A

High peak current limit of 22 A allows for driving demanding peripherals and components with ease.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type ensures signal integrity and reliable performance in driving peripherals.

Output Current Flow Direction: SOURCE AND SINK

Source and sink current flow direction capability enables bidirectional control of connected devices, enhancing functionality.

Technical Specifications

Peripheral Drivers BTM7750GXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

22 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

BTM7750GXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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