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BTM7700GXUMA1

Infineon Technologies

BTM7700GXUMA1 by Infineon Technologies

BTM7700GXUMA1 by Infineon Technologies is a 28-terminal peripheral driver with a nominal output peak current limit of 9.5A. It features a small outline package style and gull wing terminal form, suitable for applications requiring source and sink output current flow direction. Ideal for various electronic devices needing buffer or inverter-based interface ICs.

Median Price

$3.725

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$3.725

100+ parts

-

1k+ parts

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93

$3.725

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Chip Stock

USA . 14,303 parts In-Stock

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14,303

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Vyrian

USA . 8,746 parts In-Stock

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8,746

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VNN

France . 3,789 parts In-Stock

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3,789

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Digiode

USA . 746 parts In-Stock

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746

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.655

100+ parts

-

1k+ parts

$3.509

10k+ parts

-

2,000

$3.655

-

$3.509

-

Corohmni

South Africa . 188 parts In-Stock

1+ parts

$3.725

100+ parts

-

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188

$3.725

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Modulus Dynamics

Lithuania . 122 parts In-Stock

1+ parts

$3.725

100+ parts

$3.576

1k+ parts

$3.427

10k+ parts

-

122

$3.725

$3.576

$3.427

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Continental Prestige Electronics

USA . 6,636 parts In-Stock

1+ parts

$3.730

100+ parts

-

1k+ parts

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10k+ parts

$3.655

6,636

$3.730

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-

$3.655

Argo Parts USA

USA . 2,002 parts In-Stock

1+ parts

$3.730

100+ parts

-

1k+ parts

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2,002

$3.730

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AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$7.787

100+ parts

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716

$7.787

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Aztec Data Supply Inc.

USA . 4,982 parts In-Stock

1+ parts

$10.290

100+ parts

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4,982

$10.290

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Ampacity Inc.

Singapore . 177 parts In-Stock

1+ parts

$31.500

100+ parts

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177

$31.500

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Semicontronic

India . 1,372 parts In-Stock

1+ parts

$47.500

100+ parts

$46.312

1k+ parts

$46.075

10k+ parts

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1,372

$47.500

$46.312

$46.075

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Component Stockers USA

USA . 393 parts In-Stock

1+ parts

$99.990

100+ parts

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393

$99.990

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Lixinc

USA . 18,813 parts In-Stock

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18,813

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RC Electronics

USA . 7,635 parts In-Stock

1+ parts

-

100+ parts

$3.800

1k+ parts

$3.470

10k+ parts

$3.370

7,635

-

$3.800

$3.470

$3.370

Perfect Parts

USA . 4,023 parts In-Stock

1+ parts

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4,023

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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100+ parts

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900

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Corphita

USA . 897 parts In-Stock

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897

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Microchip USA

USA . 364 parts In-Stock

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364

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Overview

Upgrade your peripheral drivers with the BTM7700GXUMA1 by Infineon Technologies. This high-quality product offers unmatched reliability and performance, thanks to its manufacturer's reputation for excellence. Perfect for a wide range of applications, this peripheral driver provides value by delivering optimal output current flow direction and a nominal output peak current limit of 9.5 A. Trust in the BTM7700GXUMA1 to enhance your systems and streamline your operations effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that can easily fit into existing equipment or designs.

No. of Terminals: 28

Having 28 terminals allows for versatile connections and interface options, offering flexibility in usage scenarios.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables compact design and efficient use of space, suitable for applications with limited area.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable performance over time.

Terminal Position: DUAL

Dual terminal position adds to the versatility of the product by enabling different connection configurations to suit various requirements.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting onto PCBs, making installation hassle-free and reliable.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product's ability to withstand moderate levels of humidity and environmental conditions, ensuring operational robustness.

Nominal Output Peak Current Limit: 9.5 A

High peak current limit of 9.5 A allows for driving demanding loads or peripherals with strong power requirements, enhancing overall functionality.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter-based interface IC type provides signal conditioning and amplification capabilities, enhancing signal quality and ensuring reliable communication with peripherals.

Output Current Flow Direction: SOURCE AND SINK

Source and sink output current flow direction allows bidirectional control of connected devices, offering versatility in handling different load types and configurations.

Technical Specifications

Peripheral Drivers BTM7700GXUMA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

9.5 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

BTM7700GXUMA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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