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BTM7751G

Infineon Technologies

BTM7751G by Infineon Technologies

BTM7751G by Infineon is a peripheral driver with 28 terminals, MOS technology, and built-in protections for transient, over current, thermal, and under voltage. It operates at supply voltages ranging from 8V to 18V and has a peak output current limit of 22A. Ideal for applications requiring buffer or inverter based peripheral drivers in compact spaces.

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7

In-Stock Inventory

1k+

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VNN

France . 3,298 parts In-Stock

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ComSIT USA

USA . 2,480 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,129 parts In-Stock

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Digiode

USA . 898 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

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LIBRA Elektronik GmbH

Germany . 19 parts In-Stock

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Ampacity Inc.

Singapore . 658 parts In-Stock

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$2.500

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Modulus Dynamics

Lithuania . 489 parts In-Stock

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$5.510

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$5.290

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$5.069

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Corohmni

South Africa . 406 parts In-Stock

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$6.494

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AZTECH Wire

Italy . 875 parts In-Stock

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Andel Nordic

Denmark . 1,028 parts In-Stock

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$11.330

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Lixinc

USA . 13,566 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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Alle Elektronik GmbH

Germany . 1,102 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of your electronics with the BTM7751G by Infineon Technologies, a top-tier manufacturer known for quality and reliability. As a peripheral driver, this versatile component offers built-in protections against transient events, over current, thermal issues, and under voltage conditions. With a wide range of applications and a compact design, the BTM7751G provides unmatched value and benefits to customers seeking efficient and dependable performance. Say goodbye to worries about supply voltage limitations and unleash the full potential of your electronic devices with the BTM7751G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures long-term reliability of the product.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Maximum Supply Voltage: 18 V

Supports a wide range of supply voltages, making it versatile and compatible with various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and protection of the peripheral driver as well as the connected components.

Power Supplies (V): 8/18

Supports dual power supplies, providing flexibility in voltage requirements for different operating conditions.

Nominal Output Peak Current Limit: 22 A

High peak current limit allows for driving of high-power peripherals without the risk of overload or damage.

Technical Specifications

Peripheral Drivers BTM7751G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

22 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/18

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

180 us

Turn-on Time:

180 us

Width:

7.6 mm

Trade Compliance

BTM7751G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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