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BTM7710GP

Infineon Technologies

BTM7710GP by Infineon Technologies

BTM7710GP by Infineon Technologies is a peripheral driver with 2 functions, AEC-Q100 screening level, and built-in protections for over voltage, thermal, and under voltage. It operates at supply voltages of 8/18V and has a peak output current limit of 15A. Ideal for applications requiring a half bridge based peripheral driver with source and sink output current flow direction.

Median Price

$4.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.850

10k+ parts

$4.410

5,500

-

-

$4.850

$4.410

Vyrian

USA . 596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

596

-

-

-

-

VNN

France . 589 parts In-Stock

1+ parts

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589

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-

-

-

Digiode

USA . 294 parts In-Stock

1+ parts

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294

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-

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 266 parts In-Stock

1+ parts

$11.337

100+ parts

$10.884

1k+ parts

$10.430

10k+ parts

-

266

$11.337

$10.884

$10.430

-

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$16.139

100+ parts

-

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596

$16.139

-

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

1+ parts

$32.500

100+ parts

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1,552

$32.500

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Perfect Parts

USA . 12,535 parts In-Stock

1+ parts

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12,535

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A-Z Elektronik GmbH

Germany . 6,654 parts In-Stock

1+ parts

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100+ parts

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6,654

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Alle Elektronik GmbH

Germany . 4,436 parts In-Stock

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4,436

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Continental Prestige Electronics

USA . 4,066 parts In-Stock

1+ parts

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4,066

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Glotronic Ltd.

UK . 3,900 parts In-Stock

1+ parts

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100+ parts

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3,900

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-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,500

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Argo Parts USA

USA . 1,485 parts In-Stock

1+ parts

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1,485

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Corphita

USA . 523 parts In-Stock

1+ parts

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523

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Experience the power of cutting-edge technology with the Infineon Technologies BTM7710GP peripheral driver. Crafted with precision and expertise by a trusted manufacturer, this product offers unparalleled quality and reliability. Ideal for a variety of applications, this peripheral driver provides built-in protections against overvoltage, thermal issues, and undervoltage, ensuring optimal performance and safety. With a nominal output peak current limit of 15A and interface IC type of half bridge based peripheral driver, the BTM7710GP delivers exceptional value by enhancing efficiency and functionality in your projects. Elevate your work to new heights with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 42 V

Can handle high supply voltages, making it suitable for a range of applications.

No. of Functions: 2

Offers multiple functions in a single device, reducing the need for additional components.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Built-in Protections: OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Ensures the safety and longevity of the peripheral driver by protecting against potential damage from voltage spikes, overheating, and undervoltage conditions.

Power Supplies (V): 8/18

Supports a wide range of power supply voltages, offering flexibility in design and application.

No. of Terminals: 15

Provides multiple connection points for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the circuit board, ideal for applications with limited physical space.

Minimum Supply Voltage: 1.8 V

Can operate at low supply voltages, suitable for energy-efficient applications.

Terminal Position: SINGLE

Simplifies installation and connection to other components, reducing complexity in circuit design.

Maximum Seated Height: 4.4 mm

Low profile design allows for easy integration into compact electronic devices.

Width: 9.25 mm

Narrow width saves board space and allows for efficient layout of components.

Peak Reflow Temperature °C: 245

Withstands high temperatures during the reflow soldering process, ensuring reliable solder connections.

Length: 21.6 mm

Compact length makes it suitable for space-constrained applications.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections and ease of installation on the circuit board.

Turn-on Time: 160 us

Fast turn-on time allows for quick response in switching operations, improving system performance.

Terminal Pitch: 1.4 mm

Close terminal pitch enables compact design and efficient use of space on the circuit board.

Driver No. of Bits: 4

Four bits of driver functionality provide precision control and flexibility in peripheral operations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 ensures proper handling and storage to prevent moisture-related damage during assembly and reflow processes.

Nominal Output Peak Current Limit: 15 A

High output current limit allows for driving demanding loads with ease and efficiency.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half bridge-based interface IC type offers versatile and efficient control for peripheral devices.

Turn-off Time: 160 us

Fast turn-off time facilitates rapid switching and precise control in peripheral operations.

Output Current Flow Direction: SOURCE AND SINK

Supports both source and sink current flow, enabling bidirectional control and operation of external devices.

Technical Specifications

Peripheral Drivers BTM7710GP attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PSSO-G15

Length:

21.6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

15

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP15H,.6,55TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

8/18

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.4 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.4 mm

Terminal Position:

SINGLE

Turn-off Time:

160 us

Turn-on Time:

160 us

Width:

9.25 mm

Trade Compliance

BTM7710GP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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