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BTM7810KXT

Infineon Technologies

BTM7810KXT by Infineon Technologies

BTM7810KXT by Infineon Technologies is a peripheral driver with 2 functions, operating at 1.8-42V. It offers built-in protections for over/under voltage and thermal issues. This small outline package is ideal for applications requiring a half bridge based peripheral driver with source/sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 1,880 parts In-Stock

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Digiode

USA . 905 parts In-Stock

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Vyrian

USA . 676 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 1,835 parts In-Stock

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$9.033

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$8.672

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$8.310

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1,835

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AZTECH Wire

Italy . 333 parts In-Stock

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$16.604

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Ampacity Inc.

Singapore . 970 parts In-Stock

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$39.500

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Continental Prestige Electronics

USA . 5,959 parts In-Stock

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Argo Parts USA

USA . 870 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

USA . 338 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BTM7810KXT by Infineon Technologies. This top-of-the-line peripheral driver offers unparalleled quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications, this product provides built-in protections against over voltage, thermal issues, and under voltage, ensuring peace of mind for customers. With fast turn-on and turn-off times, a high output peak current limit, and versatile source and sink capabilities, the BTM7810KXT delivers exceptional value and performance that sets it apart from the competition. Elevate your projects to new heights with the BTM7810KXT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the peripheral driver.

Surface Mount: YES

Being surface mount allows for easier installation and space-saving on PCBs, making it convenient for assembly.

Maximum Supply Voltage: 42 V

The high maximum supply voltage capability makes this peripheral driver suitable for a wide range of applications requiring higher voltage levels.

Built-in Protections: OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of the peripheral driver by safeguarding it against overvoltage, thermal issues, and undervoltage conditions.

No. of Terminals: 15

Having 15 terminals allows for more connectivity options and versatility in circuit design.

Turn-on Time: 220 us

The fast turn-on time of 220 microseconds ensures quick and responsive operation of the peripheral driver.

Nominal Output Peak Current Limit: 42 A

With a high peak current limit of 42A, this peripheral driver can handle demanding loads and power requirements effectively.

Turn-off Time: 250 us

The short turn-off time of 250 microseconds enhances the efficiency and performance of the peripheral driver.

Output Current Flow Direction: SOURCE AND SINK

Being able to both source and sink current provides flexibility in the control and operation of connected devices and components.

Technical Specifications

Peripheral Drivers BTM7810KXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSSO-G15

Length:

21.6 mm

No. of Functions:

2

No. of Terminals:

15

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

42 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

4.4 mm

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

250 us

Turn-on Time:

220 us

Width:

9.25 mm

Trade Compliance

BTM7810KXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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