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TND316S-TL-E

Onsemi

TND316S-TL-E by Onsemi

TND316S-TL-E by Onsemi is a CMOS peripheral driver with 8 terminals, operating b/w -40 °C to 125°C. It supports power supplies of 5V and 18V, making it ideal for automotive applications. This surface-mount device in a small outline package is designed for driving peripherals efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,332 parts In-Stock

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Digiode

USA . 998 parts In-Stock

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998

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$2.785

100+ parts

$2.534

1k+ parts

$2.284

10k+ parts

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10

$2.785

$2.534

$2.284

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AZTECH Wire

Italy . 1,036 parts In-Stock

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$16.490

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Problanco Electronics

Mexico . 4,637 parts In-Stock

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4,637

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Kulean Microsystems

USA . 2,804 parts In-Stock

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Corphita

USA . 1,396 parts In-Stock

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1,396

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SupplyDigital Components

Austria . 966 parts In-Stock

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966

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UHIMA Technologies

Türkiye . 607 parts In-Stock

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TANS Electronics

Latvia . 525 parts In-Stock

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Microchip USA

USA . 289 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Enhance your electronic projects with the TND316S-TL-E by Onsemi, a top-quality peripheral driver that delivers reliable performance and durability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the highest standards of quality and innovation. Ideal for automotive applications, this compact and versatile driver offers customers unmatched value and convenience. Upgrade your projects today with the TND316S-TL-E and experience the superior performance and efficiency it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easier and more efficient installation on circuit boards, saving time during assembly.

Power Supplies (V): 5,18

The multiple power supply options of 5V and 18V provide flexibility in compatibility with different systems and voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for connections to multiple components or systems, increasing the versatility of the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in demanding environments with elevated temperatures.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish offers good solderability and corrosion resistance, contributing to the product's overall reliability.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use indicates that the product meets strict industry standards for performance and durability, making it suitable for automotive applications.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, improving overall efficiency and performance of the driver.

Technical Specifications

Peripheral Drivers TND316S-TL-E attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,18

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND316S-TL-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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