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TND307TD

Onsemi

TND307TD by Onsemi

TND307TD by Onsemi is a CMOS peripheral driver with 8 terminals, operating temperature range of -40 to 125 °C. It has a power supply range of 4.5-25V and is suitable for automotive applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,201 parts In-Stock

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Digiode

USA . 408 parts In-Stock

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408

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Problanco Electronics

Mexico . 8,046 parts In-Stock

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8,046

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Kulean Microsystems

USA . 5,950 parts In-Stock

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5,950

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Corphita

USA . 2,109 parts In-Stock

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SupplyDigital Components

Austria . 1,578 parts In-Stock

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TANS Electronics

Latvia . 1,029 parts In-Stock

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Corohmni

South Africa . 114 parts In-Stock

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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Overview

Experience the next level of performance with the TND307TD by Onsemi. As a leader in the industry, Onsemi delivers top-quality peripheral drivers that are versatile and reliable. The TND307TD is designed to meet all your application needs with its innovative features and superior functionality. Whether you're looking for automotive solutions or industrial applications, this product offers unmatched value and benefits. Upgrade your projects today with the TND307TD and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular package shape saves space on the circuit board and enables efficient placement in compact electronic devices.

Power Supplies (V): 4.5/25

Wide range of power supply options allows for compatibility with various voltage requirements in different applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components in the circuit and allows for multiple functions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance even in cold environments, enhancing the product's versatility.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, reducing the risk of connection failures.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the product can withstand the harsh conditions and temperature fluctuations in vehicles.

Technology: CMOS

CMOS technology provides high noise immunity, low power consumption, and fast switching speeds, enhancing the performance and efficiency of the product.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and mounting on the circuit board, simplifying the assembly process.

Terminal Pitch: 0.635 mm

Narrow terminal pitch enables high-density mounting on the circuit board, saving space and facilitating compact designs.

Driver No. of Bits: 2

Having 2 bits allows for precise control and manipulation of peripheral devices, offering more functionality and customization options.

Technical Specifications

Peripheral Drivers TND307TD attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TND307TD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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