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TND314S-TL-E

Onsemi

TND314S-TL-E by Onsemi

TND314S-TL-E by Onsemi is a CMOS peripheral driver with 8 terminals, operating b/w -40°C to 125°C. It has a power supply range of 4.5V to 25V and is suitable for automotive applications due to its tin/bismuth terminal finish and small outline package style.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19,750 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.290

10k+ parts

$1.150

19,750

-

$1.560

$1.290

$1.150

DigiKey

USA . 19,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.330

10k+ parts

-

19,750

-

-

$1.330

-

Verical

USA . 13,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.613

10k+ parts

$1.438

13,750

-

-

$1.613

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,049 parts In-Stock

1+ parts

$1.216

100+ parts

-

1k+ parts

-

10k+ parts

-

1,049

$1.216

-

-

-

Vyrian

USA . 546 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

-

10k+ parts

-

546

$1.280

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 230 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$1.152

-

-

-

Corohmni

South Africa . 154 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$1.280

-

-

-

Component Stockers USA

USA . 11,716 parts In-Stock

1+ parts

$1.300

100+ parts

$1.220

1k+ parts

$1.110

10k+ parts

$1.110

11,716

$1.300

$1.220

$1.110

$1.110

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$8.297

100+ parts

$7.550

1k+ parts

$6.804

10k+ parts

-

2,500

$8.297

$7.550

$6.804

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,651 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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27,651

-

-

-

-

Continental Prestige Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

$1.090

1k+ parts

-

10k+ parts

-

20,000

-

$1.090

-

-

TANS Electronics

Latvia . 7,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,787

-

-

-

-

Problanco Electronics

Mexico . 6,122 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,122

-

-

-

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Microchip USA

USA . 5,806 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,806

-

-

-

-

Kulean Microsystems

USA . 5,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,257

-

-

-

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SupplyDigital Components

Austria . 3,406 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,406

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-

-

-

UHIMA Technologies

Türkiye . 844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

844

-

-

-

-

Overview

Enhance your automotive electronics with the high-quality TND314S-TL-E peripheral driver by Onsemi. Designed with precision and reliability in mind, this small outline package offers a wide range of applications for your driving needs. From controlling motors to managing LED displays, this driver provides exceptional performance and efficiency. With a temperature grade suitable for automotive use and a durable terminal finish, customers can trust in the value and benefits that this product brings to their projects. Experience the advantage of Onsemi's cutting-edge technology and elevate your electronic designs with the TND314S-TL-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs.

Power Supplies (V): 4.5/25

The wide range of power supplies (4.5V to 25V) provides flexibility in designing circuits and compatibility with different voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and versatility in circuit design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and stability in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and reliability in electrical connections.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand extreme temperatures and harsh conditions typically found in automotive applications.

Technology: CMOS

The use of CMOS technology allows for low power consumption and high noise immunity, making the product energy-efficient and reliable.

Driver No. of Bits: 2

Having 2 driver bits allows for efficient control and management of signals or data in the circuit.

Technical Specifications

Peripheral Drivers TND314S-TL-E attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND314S-TL-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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