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TND314S

Onsemi

TND314S by Onsemi

The Onsemi TND314S is a CMOS peripheral driver with 8 terminals, operating b/w -40 to 125 °C. It supports power supplies from 4.5V to 24V and has a small outline package shape for automotive applications. The driver features dual terminal positions and gull wing form, making it suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,324 parts In-Stock

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2,324

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Vyrian

USA . 713 parts In-Stock

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713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,034 parts In-Stock

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5,034

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Kulean Microsystems

USA . 4,339 parts In-Stock

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4,339

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TANS Electronics

Latvia . 3,855 parts In-Stock

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3,855

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SupplyDigital Components

Austria . 2,819 parts In-Stock

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2,819

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Corphita

USA . 921 parts In-Stock

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921

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Corohmni

South Africa . 309 parts In-Stock

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309

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Overview

Experience unmatched quality and reliability with the TND314S by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch peripheral drivers that are perfect for a wide range of applications. With a focus on innovation and performance, this product offers customers unparalleled value and benefits. Whether you need to drive LEDs or motors, the TND314S provides the efficiency and precision you require. Trust Onsemi for all your driver needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product, suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Power Supplies (V): 4.5/24

Wide range of power supply options (4.5V to 24V) provides flexibility for different applications and compatibility with various systems.

No. of Terminals: 8

Having 8 terminals allows for connectivity to multiple components or devices, increasing the versatility of the product.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures the product can function reliably in demanding conditions and industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables the product to operate effectively in cold environments or during temperature fluctuations.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring that the product meets the required standards for performance and reliability in vehicle systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for various electronic applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product allows for precise and compact connections on the PCB, enabling efficient signal transmission.

Driver No. of Bits: 2

Having 2 bits for the driver allows for binary control and flexibility in driving peripheral devices, making the product suitable for various digital applications.

Technical Specifications

Peripheral Drivers TND314S attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND314S Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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