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TND312S

Onsemi

TND312S by Onsemi

The Onsemi TND312S is a CMOS peripheral driver with 8 terminals, operating b/w -40 to 125 °C. It supports power supplies from 4.5V to 25V and is ideal for automotive applications due to its small outline package and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,151 parts In-Stock

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Vyrian

USA . 1,725 parts In-Stock

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1,725

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Distributors (Availability)

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Problanco Electronics

Mexico . 5,217 parts In-Stock

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5,217

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TANS Electronics

Latvia . 3,955 parts In-Stock

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3,955

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SupplyDigital Components

Austria . 2,018 parts In-Stock

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Corphita

USA . 907 parts In-Stock

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907

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Corohmni

South Africa . 301 parts In-Stock

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Kulean Microsystems

USA . 145 parts In-Stock

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145

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the TND312S by Onsemi. Crafted with precision and excellence, this peripheral driver offers unparalleled quality and reliability. Ideal for automotive applications, this small outline package provides a wide operating temperature range, ensuring optimal performance in any condition. With its dual terminal position and CMOS technology, the TND312S delivers seamless integration and efficiency. Trust Onsemi to bring you cutting-edge solutions that elevate your projects to new heights. Experience the difference with the TND312S and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for automotive applications where weight reduction is crucial.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, saving time and effort during assembly.

Power Supplies (V): 4.5/25

The wide range of power supply voltages (4.5V to 25V) allows for versatility and compatibility with various systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand high temperature environments, making it suitable for automotive use.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, resulting in efficient and reliable operation.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent requirements for temperature, reliability, and durability in automotive environments.

Technical Specifications

Peripheral Drivers TND312S attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND312S Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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