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TND313S

Onsemi

TND313S by Onsemi

TND313S by Onsemi is a CMOS peripheral driver with 2 bits, operating at -40 to 125 °C. It has 8 terminals in a small outline package suitable for automotive applications. With power supplies ranging from 4.5V to 25V, it offers surface mount capability and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,745 parts In-Stock

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Vyrian

USA . 969 parts In-Stock

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969

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,301 parts In-Stock

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7,301

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Kulean Microsystems

USA . 6,191 parts In-Stock

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6,191

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SupplyDigital Components

Austria . 2,225 parts In-Stock

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2,225

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TANS Electronics

Latvia . 1,517 parts In-Stock

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Corphita

USA . 1,323 parts In-Stock

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1,323

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UHIMA Technologies

Türkiye . 462 parts In-Stock

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462

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Corohmni

South Africa . 147 parts In-Stock

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Overview

Upgrade your electronics with the TND313S by Onsemi, a superior quality peripheral driver that offers unmatched performance and reliability. Designed by the reputable manufacturer Onsemi, this compact device is perfect for a wide range of applications in the automotive industry and beyond. With its advanced technology and durable construction, the TND313S ensures seamless integration and optimal functionality. Experience the value and efficiency that this product brings to your projects, setting you apart from the competition. Choose the TND313S for unparalleled benefits and advantages that will elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Power Supplies (V): 4.5/25

The wide range of power supply voltage (4.5-25V) allows for flexibility in different operating environments and power sources.

No. of Terminals: 8

The multiple terminals provide connectivity options and enable the product to interface with various components in a circuit.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand elevated temperatures, making it suitable for industrial or automotive applications.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Driver No. of Bits: 2

Having 2 driver bits allows for precise control and manipulation of signals, making the product versatile and suitable for complex electronic systems.

Technical Specifications

Peripheral Drivers TND313S attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND313S Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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