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XSN6507DGQR

Texas Instruments

XSN6507DGQR by Texas Instruments

XSN6507DGQR by Texas Instruments is a peripheral driver with a max supply voltage of 36V and nominal output peak current limit of 1.3A. It operates in temperatures ranging from -55°C to 125°C, making it suitable for various industrial applications requiring high-performance buffer or inverter-based interface ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,898 parts In-Stock

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6,898

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Digiode

USA . 4,805 parts In-Stock

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4,805

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 67 parts In-Stock

1+ parts

$3.855

100+ parts

-

1k+ parts

$4.339

10k+ parts

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67

$3.855

-

$4.339

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$3.958

100+ parts

$3.760

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$3.760

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350

$3.958

$3.760

$3.760

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DigiPath Technology Company

USA . 2,348 parts In-Stock

1+ parts

$4.244

100+ parts

$3.905

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-

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2,348

$4.244

$3.905

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ChromeModa Solutions

Germany . 5,079 parts In-Stock

1+ parts

$4.331

100+ parts

$3.551

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5,079

$4.331

$3.551

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IDEA Electronic Components Group

UK . 10 parts In-Stock

1+ parts

$4.331

100+ parts

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$3.898

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10

$4.331

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$3.898

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Corohmni

South Africa . 357 parts In-Stock

1+ parts

$6.612

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357

$6.612

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AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$8.277

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551

$8.277

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Semicontronic

India . 846 parts In-Stock

1+ parts

$23.500

100+ parts

$22.912

1k+ parts

$22.795

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846

$23.500

$22.912

$22.795

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Ampacity Inc.

Singapore . 1,323 parts In-Stock

1+ parts

$24.500

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1,323

$24.500

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One Stop Electronics

USA . 610 parts In-Stock

1+ parts

$38.500

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610

$38.500

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Argo Parts USA

USA . 3,307 parts In-Stock

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Continental Prestige Electronics

USA . 1,203 parts In-Stock

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Corphita

USA . 293 parts In-Stock

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293

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Modulus Dynamics

Lithuania . 77 parts In-Stock

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77

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Robosynatics

Brazil . 20 parts In-Stock

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20

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Lucentia Tech

USA . 20 parts In-Stock

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$127.065

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$127.065

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$127.065

20

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$127.065

$127.065

$127.065

Bastille Electronics

Australia . 18 parts In-Stock

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18

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Overview

Enhance your electronic projects with the XSN6507DGQR from Texas Instruments, a top-tier manufacturer known for quality and reliability. This peripheral driver is designed to deliver exceptional performance in a wide range of applications. With a maximum supply voltage of 36V and a nominal output peak current limit of 1.3A, this product offers unmatched value and benefits to customers seeking high-quality solutions. Trust Texas Instruments to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 36 V

The high maximum supply voltage of 36V allows the peripheral driver to handle a wide range of input voltages, increasing its versatility.

Package Shape: SQUARE

The square package shape ensures easy integration into electronic devices and provides a compact footprint.

No. of Terminals: 10

Having 10 terminals provides ample connectivity options for various inputs and outputs, making the peripheral driver versatile.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3V allows the peripheral driver to operate efficiently even with lower power sources, increasing its compatibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the peripheral driver can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the peripheral driver to function reliably in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connections, ensuring reliable operation and ease of installation.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact design and easy integration into space-constrained electronic devices.

Width: 3 mm

The narrow width of 3mm makes the peripheral driver suitable for compact circuit board layouts, saving space in electronic designs.

Length: 3 mm

The small length of 3mm ensures a compact footprint and easy integration into electronic devices with limited space.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections, ensuring stable performance in various operating conditions.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V is commonly used in many applications, ensuring compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on circuit boards, maximizing space utilization in electronic designs.

Nominal Output Peak Current Limit: 1.3 A

The nominal output peak current limit of 1.3A ensures reliable operation and protection against overcurrent situations, safeguarding connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver provides flexibility in signal processing and can be tailored to specific application requirements.

Technical Specifications

Peripheral Drivers XSN6507DGQR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G10

Length:

3 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Nominal Output Peak Current Limit:

1.3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

XSN6507DGQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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