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NVH4L080N120SC1

Onsemi

NVH4L080N120SC1 by Onsemi

NVH4L080N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage. It has 125A Pulsed Drain Current and 171mJ Avalanche Energy Rating, ideal for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers a max power dissipation of 170W and can handle temperatures from -55 to 175 °C.

Median Price

$10.895

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 319 parts In-Stock

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$5.960

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319

$5.960

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Farnell

UK . 871 parts In-Stock

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$8.960

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$6.650

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$6.070

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871

$8.960

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$6.070

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Chip1Stop

Japan . 439 parts In-Stock

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$9.890

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$9.890

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Mouser Electronics

USA . 689 parts In-Stock

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$11.900

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$11.900

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DigiKey

USA . 267 parts In-Stock

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$11.900

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$7.143

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$5.775

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267

$11.900

$7.143

$5.775

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Newark

USA . 1,161 parts In-Stock

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$14.770

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Element14

Singapore . 911 parts In-Stock

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$15.790

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Rochester

USA . 1,968 parts In-Stock

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$5.780

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$5.170

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$4.860

1,968

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$5.780

$5.170

$4.860

Verical

USA . 1,914 parts In-Stock

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$7.225

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$6.463

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1,914

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$6.463

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RS (Exports)

UK . 410 parts In-Stock

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$23.743

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$22.561

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410

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$23.743

$22.561

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Distributors (In-Stock)

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Digiode

USA . 2,470 parts In-Stock

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$7.302

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Vyrian

USA . 1,056 parts In-Stock

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$7.686

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Flip Electronics

USA . 1,350 parts In-Stock

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Cyclops Electronics Ltd

UK . 900 parts In-Stock

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900

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Distributors (Availability)

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Corphita

USA . 1,473 parts In-Stock

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$6.917

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$6.917

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Corohmni

South Africa . 464 parts In-Stock

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$7.686

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464

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Continental Prestige Electronics

USA . 1,397 parts In-Stock

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$13.940

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Microchip USA

USA . 2,692 parts In-Stock

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$55.244

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Lixinc

USA . 8,416 parts In-Stock

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SupplyDigital Components

Austria . 7,570 parts In-Stock

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TANS Electronics

Latvia . 6,161 parts In-Stock

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Kulean Microsystems

USA . 5,112 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 942 parts In-Stock

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UHIMA Technologies

Türkiye . 827 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 265 parts In-Stock

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Overview

Experience top-notch performance with the NVH4L080N120SC1 by Onsemi! As a leading manufacturer in the industry, Onsemi delivers superior quality power field effect transistors that are perfect for switching applications. With a high breakdown voltage of 1200V and a maximum drain current of 29A, this N-CHANNEL transistor offers unmatched reliability and efficiency. Whether you're looking for enhanced power dissipation or quick response times, this product is designed to meet your needs. Say goodbye to limitations and hello to endless possibilities with the NVH4L080N120SC1!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, provides good protection for the internal components.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and control in the specified direction.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient configuration with a built-in diode for easy integration into circuits.

Maximum Pulsed Drain Current (IDM): 125 A

High pulsed drain current capability suitable for demanding applications.

Maximum Power Dissipation (Abs): 170 W

High power dissipation rating allows for continuous and stable operation under heavy loads.

Maximum Operating Temperature: 175 °C

Wide operating temperature range for use in various environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L080N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

171 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

125 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

53 ns

Maximum Turn On Time (ton):

28 ns

Trade Compliance

NVH4L080N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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