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NVH4L050N065SC1

Onsemi

NVH4L050N065SC1 by Onsemi

NVH4L050N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It features a max IDM of 391A and ID of 62.6A, making it suitable for high-power applications. With a package style of FLANGE MOUNT and operating temperatures ranging from -55 to 175 °C, it is ideal for industrial power systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,672 parts In-Stock

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Digiode

USA . 161 parts In-Stock

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Problanco Electronics

Mexico . 3,518 parts In-Stock

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TANS Electronics

Latvia . 3,181 parts In-Stock

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SupplyDigital Components

Austria . 1,977 parts In-Stock

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Corphita

USA . 1,875 parts In-Stock

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Kulean Microsystems

USA . 489 parts In-Stock

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UHIMA Technologies

Türkiye . 283 parts In-Stock

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Corohmni

South Africa . 136 parts In-Stock

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Overview

Unleash the power of the NVH4L050N065SC1 by Onsemi, a premium Power Field Effect Transistor that guarantees top-notch quality and performance. Manufactured by Onsemi, a renowned industry leader, this N-CHANNEL FET with a built-in diode offers unparalleled reliability and efficiency. Ideal for various applications, this transistor will elevate your projects to the next level with its impressive capabilities. Say goodbye to subpar performance and hello to excellence with the NVH4L050N065SC1 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds, making them suitable for high-performance applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 391 A

The high pulsed drain current rating allows this FET to handle short-duration high current spikes without damage, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 338 W

This high power dissipation rating indicates that the FET can handle high power levels without overheating, making it reliable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in high-temperature environments without performance degradation.

Transistor Element Material: SILICON CARBIDE

Silicon carbide is known for its high thermal conductivity and wide bandgap, making it suitable for high-power and high-temperature applications.

Maximum Feedback Capacitance (Crss): 14.42 pF

The low feedback capacitance helps reduce signal distortion and improve high-frequency performance in amplification applications.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L050N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

62.6 A

Maximum Drain Current (ID):

62.6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14.42 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

391 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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