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NVH4L045N065SC1

Onsemi

NVH4L045N065SC1 by Onsemi

NVH4L045N065SC1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 65.5A Drain Current. Ideal for high-power applications, it features a single configuration with built-in diode and operates in enhancement mode. With a max power dissipation of 338W, this MOSFET is suitable for various industrial uses.

Median Price

$18.512

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 640 parts In-Stock

1+ parts

$3.208

100+ parts

-

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640

$3.208

-

-

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Mouser Electronics

USA . 444 parts In-Stock

1+ parts

$18.890

100+ parts

-

1k+ parts

$12.010

10k+ parts

-

444

$18.890

-

$12.010

-

DigiKey

USA . 375 parts In-Stock

1+ parts

$18.890

100+ parts

$11.808

1k+ parts

$10.501

10k+ parts

-

375

$18.890

$11.808

$10.501

-

Chip1Stop

Japan . 159 parts In-Stock

1+ parts

$61.500

100+ parts

$27.300

1k+ parts

-

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159

$61.500

$27.300

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Future Electronics

Canada . 450 parts In-Stock

1+ parts

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$10.700

10k+ parts

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450

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$10.700

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Verical

USA . 450 parts In-Stock

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$18.512

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450

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-

$18.512

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Rochester

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$10.500

1k+ parts

$9.390

10k+ parts

$8.840

27

-

$10.500

$9.390

$8.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,737 parts In-Stock

1+ parts

$4.810

100+ parts

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1,737

$4.810

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Vyrian

USA . 3,277 parts In-Stock

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3,277

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NAC Semi

USA . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$16.460

10k+ parts

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900

-

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$16.460

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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700

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Flip Electronics

USA . 450 parts In-Stock

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450

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IBS Electronics

USA . 450 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$15.007

10k+ parts

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450

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$15.007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 90 parts In-Stock

1+ parts

$2.730

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90

$2.730

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Corphita

USA . 1,907 parts In-Stock

1+ parts

$4.557

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1,907

$4.557

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Corohmni

South Africa . 447 parts In-Stock

1+ parts

$5.063

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447

$5.063

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Microchip USA

USA . 145 parts In-Stock

1+ parts

$38.942

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145

$38.942

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QUARKTWIN TECHNOLOGY LTD

USA . 21,910 parts In-Stock

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21,910

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SupplyDigital Components

Austria . 8,385 parts In-Stock

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8,385

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Problanco Electronics

Mexico . 7,706 parts In-Stock

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7,706

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Kulean Microsystems

USA . 5,666 parts In-Stock

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5,666

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TANS Electronics

Latvia . 3,039 parts In-Stock

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3,039

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 709 parts In-Stock

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709

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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11

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Overview

Power up your applications with the NVH4L045N065SC1 from Onsemi! This high-quality N-CHANNEL Power FET offers reliable performance and efficiency, making it ideal for a wide range of power management applications. With a maximum DS Breakdown Voltage of 650V and a Maximum Drain Current of 65.5A, this transistor delivers superior power dissipation and operating temperature range. Trust in Onsemi's reputation for excellence and experience the value and benefits of the NVH4L045N065SC1 for yourself. Elevate your projects with this top-of-the-line FET today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing the reliability of the product.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the FET to handle high voltages without breakdown, making it suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 65.5 A

The high maximum drain current capability allows the FET to handle large current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 338 W

The high power dissipation rating enables the FET to handle high levels of power without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making the FET suitable for high-performance applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in harsh environmental conditions without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L045N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

65.5 A

Maximum Drain Current (ID):

65.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13.76 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

312 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVH4L045N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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